Process uniformity for plasma etchback and desmear in printed wiring board manufacturing
- Sandia National Labs., Albuquerque, NM (United States)
- Texas Instruments, Austin, TX (United States)
In the manufacture of printed wiring boards (PWB), plasma etchback and desmear processes facilitate the making of good mechanical and electrical bonds of copper inner layers to copper plating. Without sufficient plasma treatment, internal layer copper features receive inadequate polymer removal which results in circuit discontinuity during the plating process. Additionally, the plasma serves to roughen the polymer wall of drilled holes which improves copper adhesion. To ensure proper plasma treatment, careful adherence to strict production guidelines is essential. These guidelines include attention to several critical criteria in placement, pretreatment and treatment of the PWBs during the plasma process; process verification via post plasma testing; and careful process monitoring throughout. In this brief, some guidelines for process monitoring and control will be discussed. A description of a new plasma monitor utilizing optical emission spectroscopy (OES), developed cooperatively between Sandia National Laboratories, National Consortium for Manufacturing Sciences (NCMS) and Texas Instruments Inc., will be discussed along with possible benefits derived from in situ monitoring of plasma systems.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 414373
- Report Number(s):
- SAND--96-1954; ON: DE97001599
- Country of Publication:
- United States
- Language:
- English
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