Printed wiring board process improvement. Final report

Technical Report · Mon Jul 01 04:00:00 EDT 1985

OSTI ID:5649651

Evans, M E; Gentry, F L

This project investigated ways of improving printed wiring board (PWB) fabrication at BKCD. The primary objective of the machining portion was to determine the best manufacturing techniques for rigid double-sided and multilayer printed wiring products, and to identify the process changes required to implement those techniques. Another objective was to improve solder thickness and shelf life by using the hot air leveling process. All process variables were identified and a suitable manufacturing process was established. Copper plating of PWBs presently uses a solution of copper pyrophosphate that has several disadvantages. The properties of the copper deposit from an acid copper sulfate process and relative ease of chemical control offer advantages over the pyrophosphate process and are being evaluated for use.

• Research Organization: Allied Corp., Kansas City, MO (USA). Bendix Kansas City Div.
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 5649651
• Report Number(s): BDX-613-3173; ON: DE85015422
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
COPPER
DEPOSITION
DESIGN
ELECTRONIC CIRCUITS
ELEMENTS
MACHINING
METALS
PLATING
PRINTED CIRCUITS
SURFACE COATING
TRANSITION ELEMENTS