Through-hole optimization using plasma desmearing system. [Removal of resin]
Technical Report
·
OSTI ID:7221685
To assure a reliable multilayer printed wiring product, all traces of resin smear must be removed from interconnect holes prior to electroplating. Plasma processing will remove this resin smear from the new laminates being introduced to our industry as well as the standard epoxy materials. Plasma desmearing also has the potential of eliminating many of the negative aspects associated with ''wet'' chemical processing. This report describes the full characterization of a production plasma etchback/desmear system (PEDS), as used in a prototype fabrication environment. Processing parameters were established for epoxy, polyimide, and acrylic resin systems.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (USA)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 7221685
- Report Number(s):
- SAND-86-2038; ON: DE87002835
- Country of Publication:
- United States
- Language:
- English
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