Etchback smear removal process characterization. Final report
A study evaluated variable limits for each chemical solution used in etchback smear removal on multilayer printed wiring boards (MLPWBs) to determine variables' influence on etchback behavior. Etchback smear removal is essential to fabricate about 40 different multilayer parts. However, erratic etchback behavior contributes to reduced yields among multilayer parts. The study, conducted on 172 multilayer printed wiring boards in 43 test runs, indicated that chemical interaction may not be a principal influence on etchback behavior. Study results also indicated that slight changes in process variables did not influence the presence of recessed conductors. The results verified the adequacy of existing tolerances on main process variables to produce uniformly etched holes.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 6554241
- Report Number(s):
- BDX-613-2598
- Country of Publication:
- United States
- Language:
- English
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