Plasma etchback of multilayer printed wiring boards
Removal of epoxy smear and glass fiber protrusions in multilayer printed wiring board holes was investigated. Gas plasma techniques, using a mixture of carbon tetrafluoride and oxygen, removed the eposies; however, the glass fibers were not affected.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 5256047
- Report Number(s):
- BDX-613-2458
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
CARBON COMPOUNDS
CARBON FLUORIDES
CLEANING
CRYOGENIC FLUIDS
DATA
ELECTRONIC CIRCUITS
ELEMENTS
EPOXIDES
EXPERIMENTAL DATA
FABRICATION
FIBERGLASS
FLUIDS
FLUORIDES
FLUORINE COMPOUNDS
HALIDES
HALOGEN COMPOUNDS
INFORMATION
NONMETALS
NUMERICAL DATA
ORGANIC COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
OXYGEN
PLASMA
PRINTED CIRCUITS
REMOVAL
USES
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
CARBON COMPOUNDS
CARBON FLUORIDES
CLEANING
CRYOGENIC FLUIDS
DATA
ELECTRONIC CIRCUITS
ELEMENTS
EPOXIDES
EXPERIMENTAL DATA
FABRICATION
FIBERGLASS
FLUIDS
FLUORIDES
FLUORINE COMPOUNDS
HALIDES
HALOGEN COMPOUNDS
INFORMATION
NONMETALS
NUMERICAL DATA
ORGANIC COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
OXYGEN
PLASMA
PRINTED CIRCUITS
REMOVAL
USES