An investigation of the spatial location of proton-induced traps in SiGe HBTs
- Auburn Univ., AL (United States)
- Naval Surface Warfare Center, Crane, IN (United States)
- IBM Microelectronics, Hopewell Junction, NY (United States)
The effects of 46 MeV proton irradiation induced trap generation and its impact on the electrical characteristics of silicon-germanium (SiGe) heterojunction bipolar transistors (HBTs) from an advanced ultrahigh vacuum/chemical vapor deposition (UHV/CVD) SiGe BiCMOS technology are examined and discussed for the first time. At proton fluences as high as 10{sup 14} p/cm{sup 2} the peak current gain of the devices degraded by less than 8% compared to the pre-irradiated samples. The maximum oscillation frequency and cutoff frequency of the SiGe HBTs showed only minor degradation after 10{sup 14} p/cm{sup 2}. Calibration of 2-D device simulation (MEDICI) to measured data in both forward and inverse modes of operation was used to infer the spatial location of the proton-induced traps. Traps in the collector-base space charge region appear a/s generation/recombination (G/R) centers in the inverse emitter-base region and are the result of displacement damage. Traps at the emitter-base spacer oxide interface appear as G/R centers in the forward emitter-base space charge region and are the result of ionization damage. Taken together, these results suggest that UHV/CVD SiGe HBT technology is robust to proton fluences at least as high as 10{sup 13} p/cm{sup 2} without radiation hardening.
- OSTI ID:
- 323916
- Report Number(s):
- CONF-980705--
- Journal Information:
- IEEE Transactions on Nuclear Science, Journal Name: IEEE Transactions on Nuclear Science Journal Issue: 6Pt1 Vol. 45; ISSN 0018-9499; ISSN IETNAE
- Country of Publication:
- United States
- Language:
- English
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