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Power Electronics Module with Integrated Ceramic Heat Exchanger

Conference ·
DOI:https://doi.org/10.2172/3014996· OSTI ID:3014996
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  1. National Laboratory of the Rockies, Golden, CO (United States)
  2. Synteris
  3. Packet Digital
+ Show Author Affiliations
NREL, in partnership with Synteris and Packet Digital, has developed a 3D-printable ceramic package for power electronic modules to improve their thermal management, power density, performance, and lifetime. Existing power modules contain flat ceramic substrates that serve as both the electrically insulating component and thermal conductor that transfer the large heat outputs of these devices. The team has developed an additive manufacturing process that replaces the traditional insulating metalized substrate, substrate attach, and baseplate/heat exchanger with an additively-manufactured ceramic packaging that acts as both an electrical insulator and heat exchanger for better thermal management. The design, manufacturability, and function of this power module will be discussed.
Research Organization:
National Laboratory of the Rockies (NLR), Golden, CO (United States)
Sponsoring Organization:
USDOE Advanced Research Projects Agency - Energy (ARPA-E)
DOE Contract Number:
AC36-08GO28308
OSTI ID:
3014996
Report Number(s):
NLR/PR-5700-95898
Resource Type:
Conference presentation
Conference Information:
Presented at the Fifth International Symposium on 3D Power Electronics Integration & Manufacturing (3D-PEIM), 8-10 July 2025, Golden, Colorado
Country of Publication:
United States
Language:
English

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Related Subjects

25 ENERGY STORAGE
42 ENGINEERING
additive manufacturing
aluminum nitride
ceramics
packaging
power electronics
silicon carbide
substrates
thermal modeling