Advances in metal matrix composite packaging for use in alternative energy transportation systems

Conference · Tue Dec 31 04:00:00 EST 1996

OSTI ID:412095

Martinez, Jr, J L; Fusaro, J M; Romero, G L ^[1]

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1. Motorola Inc., Phoenix, AZ (United States); and others

The packaging of power semiconductors for use in ac motor control inverters for zero-emission vehicles has typically included a copper baseplate onto which a ceramic isolation structure is mounted. The ceramic isolation Structure is used to mount semiconductor devices and mechanically route the electrical Circuit. All components, including buss bars, are encased in a molded plastic housing. Due to its high thermal conductivity and low cost, copper has been the material of choice for baseplates in the manufacture of power modules. In operation, the power module is required to dissipate large amounts of heat generated by the semiconductor devices. Thermal and mechanical stresses are induced into the package due to the differences in the coefficient of thermal expansion (CTE) between the various materials. These stresses are large enough to produce cracks in the ceramic and solder bonding layers. The cracking of material in either case inhibits the removal of heat from the semiconductor devices and eventually causessemiconductor device failure. Metal Matrix Composites (MMC`s) have been used in the aerospace industry for years in structural designs and in the packaging of electronic components. Motorola`s Hybrid Power Module Operation (HPM) has been investigating MMC`s, particularly Aluminum/Silicon Carbide (AISiC), for use as the baseplate of power modules. The properties of AISiC, particularly its CTE and thermal conductivity, have made it a viable candidate to replace copper in these applications. Findings on thermal performance, reliability, manufacturability, and package integration are presented.

• OSTI ID: 412095
• Report Number(s): CONF-960310--
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
42 ENGINEERING
AEROSPACE INDUSTRY
ALUMINIUM
BONDING
COST
CRACKS
MECHANICAL PROPERTIES
PACKAGING
SEMICONDUCTOR DEVICES
SILICON CARBIDES
STRESSES
THERMAL CONDUCTIVITY
THERMAL EXPANSION