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Ga2O3 Packaging and Thermal Management Challenges and Opportunities

Conference ·
OSTI ID:1542768
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  1. National Renewable Energy Laboratory (NREL), Golden, CO (United States)
  2. Georgia Tech University
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This project addresses the early-stage research and development to design and build packages that enable practical utilization of Ga2O3 semiconductor devices in power electronic circuits. The project will encompass electrical, thermal, thermomechanical and reliability aspects in the package design. As compared to silicon (Si), SiC or GaN-based packaging, using a Ga2O3 device will require significant research and innovations in the attachment of the oxide device to substrates, attachment of the substrate to the baseplate/heat exchanger, appropriate electrical interconnections, as well as the type and location of the thermal management solutions. A thorough understanding and characterization of the thermal transport properties of the Ga2O3 device layer is also essential to understand and quantify the package performance. Addressing all these aspects will result in a high-performance, low-cost and reliable package.
Research Organization:
National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Sponsoring Organization:
USDOE National Renewable Energy Laboratory (NREL), Laboratory Directed Research and Development (LDRD) Program
DOE Contract Number:
AC36-08GO28308
OSTI ID:
1542768
Report Number(s):
NREL/PR-5400-73902
Country of Publication:
United States
Language:
English

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Related Subjects

30 DIRECT ENERGY CONVERSION
Ga2O3
gallium oxide
heat exchanger
high performance
low cost
semiconductor devices
thermal management
ultra-wide bandgap