Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

The Effects of Threshold Voltage and Number of Fins per Transistor on the TID Response of GF 12LP Technology

Journal Article · · IEEE Transactions on Nuclear Science

This abstract presents a comprehensive analysis of total ionizing dose (TID) response in GlobalFoundries’ 12LP 12nm bulk FinFET technology using 10keV X-rays. Devices with higher threshold voltages (VTs) demonstrated lower increases in off-state leakage current (IDS,OFF) post-irradiation, highlighting the mitigating role of high VT in TID response. Our data shows that transistors with fewer fins exhibit superior TID resistance, implying lower susceptibility to radiation effects. Our study also probed two bias conditions, "Gate-On" and "Pass-Gate," with the former displaying more severe TID degradation. Interestingly, p-type devices displayed negligible degradation, underscoring their inherent resilience to TID effects. Additionally, medium thick n-type devices echoed the fin-count-dependent TID response observed in other transistor types, further strengthening our findings. These results underscore the importance of strategic transistor selection and design for enhancing the TID resilience of future CMOS FinFET architectures, particularly critical in radiation-intense environments.

Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
Grant/Contract Number:
NA0003525
OSTI ID:
2311246
Report Number(s):
SAND--2024-01010J
Journal Information:
IEEE Transactions on Nuclear Science, Journal Name: IEEE Transactions on Nuclear Science Journal Issue: 1 Vol. 71; ISSN 0018-9499
Publisher:
IEEECopyright Statement
Country of Publication:
United States
Language:
English

References (20)

The sensitivity of radiation-induced leakage to STI topology and sidewall doping journal May 2011
DC response, low-frequency noise, and TID-induced mechanisms in 16-nm FinFETs for high-energy physics experiments
  • Bonaldo, Stefano; Ma, Teng; Mattiazzo, Serena
  • Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, Vol. 1033 https://doi.org/10.1016/j.nima.2022.166727
journal June 2022
Challenges in hardening technologies using shallow-trench isolation journal January 1998
The Impact of PTS Doping and Fin Angle on TID Response of 14-nm bulk FinFETs conference October 2018
Length and fin number dependence of ionizing radiation-induced degradation in bulk FinFETs conference April 2013
Single Event Upset and Total Ionizing Dose Response of 12LP FinFET Digital Circuits conference July 2022
Total Ionizing Dose and Proton Single Event Effects in AMD Ryzen Processor Fabricated in a 12-nm Bulk FinFET Process conference July 2023
Fin bending due to stress and its simulation conference September 2013
Radiation Effects in MOS Oxides journal August 2008
Geometry Dependence of Total-Dose Effects in Bulk FinFETs journal December 2014
Analysis of TID Process, Geometry, and Bias Condition Dependence in 14-nm FinFETs and Implications for RF and SRAM Performance journal January 2017
Effects of Channel Implant Variation on Radiation-Induced Edge Leakage Currents in n-Channel MOSFETs journal January 2017
Influence of Halo Implantations on the Total Ionizing Dose Response of 28-nm pMOSFETs Irradiated to Ultrahigh Doses journal January 2019
Radiation Effects in a Post-Moore World journal May 2021
Total Ionizing Dose Responses of 22-nm FDSOI and 14-nm Bulk FinFET Charge-Trap Transistors journal May 2021
Influence of Fin and Finger Number on TID Degradation of 16-nm Bulk FinFETs Irradiated to Ultrahigh Doses journal March 2022
Layout Dependence of Total Ionizing Dose Effects on 12-nm Bulk FinFET Core Digital Structures journal April 2023
FinFET scaling to 10 nm gate length conference January 2002
Fin Bending Mitigation and Local Layout Effect Alleviation in Advanced FinFET Technology through Material Engineering and Metrology Optimization conference June 2019
Modelling and Calculation of Silicon Conduction Band Structure and Parameters with Arbitrary Uniaxial Stress journal January 2018

Similar Records

Analysis of TID process, geometry, and bias condition dependence in 14-nm FinFETs and implications for RF and SRAM performance
Journal Article · Tue Dec 06 23:00:00 EST 2016 · IEEE Transactions on Nuclear Science · OSTI ID:1338310

Investigation of negative bias temperature instability dependence on fin width of silicon-on-insulator-fin-based field effect transistors
Journal Article · Tue Jan 20 23:00:00 EST 2015 · Journal of Applied Physics · OSTI ID:22412963

High tolerance to total ionizing dose of {omega}-shaped gate field-effect transistors
Journal Article · Mon May 29 00:00:00 EDT 2006 · Applied Physics Letters · OSTI ID:20779358