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Giant Magnetoresistance In Ni/Cu Multilayers Fabricated By Electron-Beam Evaporation

Journal Article · · AIP Conference Proceedings
DOI:https://doi.org/10.1063/1.2928975· OSTI ID:21137094
; ;  [1]
  1. Department of Materials and Metallurgical Engineering Indian Institute of Technology Kanpur, Uttar Pradesh, 208016 (India)
Electron beam evaporation technique has been used to deposit the multilayers of Ni-Cu, represented by Si[BL{sub t}/[Ni(t{sub FM})/Cu(t{sub NM})]xn] where Si is used as a substrate and BL is buffer layer, n is the number of bilayers, t, t{sub FM} and t{sub NM} are thicknesses of buffer layer, ferromagnetic (Ni) and nonmagnetic (Cu) layers, respectively. We characterize the multilayers using M-H curves, magnetoresistance measurement (at room temperature)
OSTI ID:
21137094
Journal Information:
AIP Conference Proceedings, Journal Name: AIP Conference Proceedings Journal Issue: 1 Vol. 1003; ISSN APCPCS; ISSN 0094-243X
Country of Publication:
United States
Language:
English

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