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Thick Pb(Zr,Ti)O{sub 3} film without substrate

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.2771377· OSTI ID:21016103
; ; ;  [1]
  1. Department of Materials Science and Engineering, Seoul National University, Seoul 151-742 (Korea, Republic of)

In order to fabricate thick PbZr{sub x}Ti{sub 1-x}O{sub 3} (PZT) films for microelectromechanical system applications, the authors introduce a concept of freestanding film without a substrate. PZT films with a thickness of up to 20 {mu}m were deposited on a very thin Pt layer without a substrate by the rf-magnetron sputtering method using a single oxide target. The Pt layer (thickness <1 {mu}m) was obtained by sputtering the Pt on a Si substrate with a carbon layer between them, and subsequently removing the carbon layer by oxidation in air at 400 deg. C. Piezoelectric properties of the film were comparable to those of bulk PZT as a result of the removal of clamping effect of the substrate.

OSTI ID:
21016103
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 7 Vol. 91; ISSN APPLAB; ISSN 0003-6951
Country of Publication:
United States
Language:
English

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