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Title: Annealing behavior between room temperature and 2000 deg. C of deep level defects in electron-irradiated n-type 4H silicon carbide

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.2009816· OSTI ID:20714059
; ; ;  [1]
  1. Department of Physics, Physical Electronics, University of Oslo, P.O. Box 1048 Blindern, N-0316 Oslo (Norway)

The annealing behavior of irradiation-induced defects in 4H-SiC epitaxial layers grown by chemical-vapor deposition has been systematically studied by means of deep level transient spectroscopy (DLTS). The nitrogen-doped epitaxial layers have been irradiated with 15-MeV electrons at room temperature and an isochronal annealing series from 100 to 2000 deg. C has been performed. The DLTS measurements, which have been carried out in the temperature range from 120 to 630 K after each annealing step, revealed the presence of six electron traps located in the energy range of 0.45-1.6 eV below the conduction-band edge (E{sub c}). The most prominent and stable ones occur at E{sub c}-0.70 eV (labeled Z{sub 1/2}) and E{sub c}-1.60 eV(EH{sub 6/7}). After exhibiting a multistage annealing process over a wide temperature range, presumably caused by reactions with migrating defects, a significant fraction of both Z{sub 1/2} and EH{sub 6/7} (25%) still persists at 2000 deg. C and activation energies for dissociation in excess of 8 and {approx}7.5 eV are estimated for Z{sub 1/2} and EH{sub 6/7}, respectively. On the basis of these results, the identity of Z{sub 1/2} and EH{sub 6/7} is discussed and related to previous assignments in the literature.

OSTI ID:
20714059
Journal Information:
Journal of Applied Physics, Vol. 98, Issue 4; Other Information: DOI: 10.1063/1.2009816; (c) 2005 American Institute of Physics; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
Country of Publication:
United States
Language:
English