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ITRW: Formulating a Roadmap for WBG and UWBG Materials and Devices

Technical Report ·
DOI:https://doi.org/10.2172/1762661· OSTI ID:1762661
 [1];  [2];  [3];  [4];  [2];  [2];  [2];  [2];  [5];  [6];  [7]
  1. North Carolina State Univ., Raleigh, NC (United States)
  2. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
  3. Alpha & Omega Semiconductor, Sunnyvale, CA (United States)
  4. Infineon Technologies, Los Angeles, CA (United States)
  5. ON Semiconductor, Oudenaarde (Belgium)
  6. Acreo Swedish ICT AB, Stockholm (Sweden)
  7. Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)

The purpose of the International Technology Roadmap for Wide-Bandgap Power Semiconductors (ITRW) Materials and Devices Working Group, which considers the materials science of Wide-and Ultra-Wide-Band-Gap (WBG and UWBG) semiconductors, in addition to device design, fabrication, and evaluation, is to formulate a long-term, international roadmap for WBG and UWBG materials and devices, consistent with the packaging and applications working groups of ITRW. The working group is co-chaired by Victor Veliadis (primarily representing silicon carbide (SiC) and related materials) and Robert Kaplar (primarily representing gallium nitride (GaN) and related materials, as well as emerging ultra-WBGs) and is split into four sub-working-groups, which are: 1) SiC materials and devices (co-chairs Jon Zhang and Mietek Bakowski). 2) Lateral GaN materials and devices (co-chairs Sameh Khalil and Peter Moens). 3) Vertical GaN materials and devices (co-chairs TBD). 4) Emerging UWBG materials and devices (co-chairs Mark Hollis). The first two subgroups represent technology that is far more mature than that of the latter two, and devices are available as commercial products in power applications. The primary focus of this article will be on developments in subgroups 1 and 2, with only brief descriptions of the latter two sub-groups, including future activities as they mature technologically.

Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States); North Carolina State Univ., Raleigh, NC (United States); Alpha & Omega Semiconductor, Sunnyvale, CA (United States); Infineon Technologies, Los Angeles, CA (United States); ON Semiconductor, Oudenaarde (Belgium); Acreo Swedish ICT AB, Stockholm (Sweden); Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA); USDOE Office of Electricity (OE)
DOE Contract Number:
AC04-94AL85000; NA0003525
OSTI ID:
1762661
Report Number(s):
SAND--2019-7778R; 677194
Country of Publication:
United States
Language:
English

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