Strongly adhesive dry transfer technique for van der Waals heterostructure

Son, Suhan; Shin, Young Jae; Zhang, Kaixuan; Shin, Young Jeacheol; Lee, Sungmin; Idzuchi, Hiroshi; Coak, Matthew J.; Kim, Hwangsun; Kim, Jangwon; Kim, Jae Hoon; Kim, Miyoung; Kim, Dohun; Kim, Philip; Park, Je-Geun

doi:10.1088/2053-1583/abad0b

Strongly adhesive dry transfer technique for van der Waals heterostructure

Journal Article · Fri Aug 21 00:00:00 EDT 2020 · 2D Materials

DOI:https://doi.org/10.1088/2053-1583/abad0b· OSTI ID:1658555

Son, Suhan ^[1]; Shin, Young Jae ^[2]; Zhang, Kaixuan ^[1]; ^[3]; Lee, Sungmin ^[4]; Idzuchi, Hiroshi ^[5]; Coak, Matthew J. ^[6]; Kim, Hwangsun ^[7]; Kim, Jangwon ^[8]; Kim, Jae Hoon ^[8]; Kim, Miyoung ^[7]; Kim, Dohun ^[3]; Kim, Philip ^[5]; ^[1]

Seoul National Univ. (South Korea). Center for Quantum Materials and Dept. of Physics and Astronomy; Inst. for Basic Science, Seoul (South Korea). Center for Correlated Electron Systems
Harvard Univ., Cambridge, MA (United States). Dept. of Physics; Brookhaven National Lab. (BNL), Upton, NY (United States). Center for Functional Nanomaterials (CFN)
Seoul National Univ. (South Korea). Dept. of Physics and Astronomy
Seoul National Univ. (South Korea). Dept. of Physics and Astronomy; Inst. for Basic Science, Seoul (South Korea). Center for Correlated Electron Systems
Harvard Univ., Cambridge, MA (United States). Dept. of Physics
Seoul National Univ. (South Korea). Dept. of Physics and Astronomy; Inst. for Basic Science, Seoul (South Korea). Center for Correlated Electron Systems; Univ. of Warwick, Coventry (United Kingdom). Dept. of Physics
Inst. for Basic Science, Seoul (South Korea). Center for Correlated Electron Systems; Seoul National Univ. (South Korea). Dept. of Materials Science and Engineering and Research Inst. of Advanced Materials
Yonsei Univ., Seoul (South Korea). Dept. of Physics

That one can stack van der Waals materials with atomically sharp interfaces has provided a new material platform of constructing heterostructures. The technical challenge of mechanical stacking is picking up the exfoliated atomically thin materials after mechanical exfoliation without chemical and mechanical degradation. Chemically inert hexagonal boron nitride (hBN) has been widely used for encapsulating and picking up vdW materials. However, due to the relatively weak adhesion of hBN, assembling vdW heterostructures based on hBN has been limited. Here, we report a new dry transfer technique. We used two vdW semiconductors (ZnPS₃ and CrPS₄) to pick up and encapsulate layers for vdW heterostructures, which otherwise are known to be hard to fabricate. By combining with optimized polycaprolactone (PCL) providing strong adhesion, we demonstrated various vertical heterostructure devices, including quasi-2D superconducting NbSe₂ Josephson junctions with atomically clean interface. The versatility of the PCL-based vdW stacking method provides a new route for assembling complex 2D vdW materials without interfacial degradation.

View Accepted Manuscript (DOE)

Research Organization:: Brookhaven National Laboratory (BNL), Upton, NY (United States)

Sponsoring Organization:: Inst. for Basic Science of the Republic of Korea; National Research Foundation of Korea (NRF); USDOE Office of Science (SC), Basic Energy Sciences (BES)

Grant/Contract Number:: SC0012704

OSTI ID:: 1658555

Alternate ID(s):: OSTI ID: 23023501

Report Number(s):: BNL--216335-2020-JAAM

Journal Information:: 2D Materials, Journal Name: 2D Materials Journal Issue: 4 Vol. 7; ISSN 2053-1583

Publisher:: IOP PublishingCopyright Statement

Country of Publication:: United States

Language:: English

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36 MATERIALS SCIENCE
NbXe2
dry transfer technique
polycaprolactone
transition metal thiophosphate
two-dimensional materials
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Strongly adhesive dry transfer technique for van der Waals heterostructure

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