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Title: Strongly adhesive dry transfer technique for van der Waals heterostructure

Journal Article · · 2D Materials
 [1];  [2];  [1]; ORCiD logo [3];  [4];  [5];  [6];  [7];  [8];  [8];  [7];  [3];  [5]; ORCiD logo [1]
  1. Seoul National Univ. (South Korea). Center for Quantum Materials and Dept. of Physics and Astronomy; Inst. for Basic Science, Seoul (South Korea). Center for Correlated Electron Systems
  2. Harvard Univ., Cambridge, MA (United States). Dept. of Physics; Brookhaven National Lab. (BNL), Upton, NY (United States). Center for Functional Nanomaterials (CFN)
  3. Seoul National Univ. (South Korea). Dept. of Physics and Astronomy
  4. Seoul National Univ. (South Korea). Dept. of Physics and Astronomy; Inst. for Basic Science, Seoul (South Korea). Center for Correlated Electron Systems
  5. Harvard Univ., Cambridge, MA (United States). Dept. of Physics
  6. Seoul National Univ. (South Korea). Dept. of Physics and Astronomy; Inst. for Basic Science, Seoul (South Korea). Center for Correlated Electron Systems; Univ. of Warwick, Coventry (United Kingdom). Dept. of Physics
  7. Inst. for Basic Science, Seoul (South Korea). Center for Correlated Electron Systems; Seoul National Univ. (South Korea). Dept. of Materials Science and Engineering and Research Inst. of Advanced Materials
  8. Yonsei Univ., Seoul (South Korea). Dept. of Physics

That one can stack van der Waals materials with atomically sharp interfaces has provided a new material platform of constructing heterostructures. The technical challenge of mechanical stacking is picking up the exfoliated atomically thin materials after mechanical exfoliation without chemical and mechanical degradation. Chemically inert hexagonal boron nitride (hBN) has been widely used for encapsulating and picking up vdW materials. However, due to the relatively weak adhesion of hBN, assembling vdW heterostructures based on hBN has been limited. Here, we report a new dry transfer technique. We used two vdW semiconductors (ZnPS3 and CrPS4) to pick up and encapsulate layers for vdW heterostructures, which otherwise are known to be hard to fabricate. By combining with optimized polycaprolactone (PCL) providing strong adhesion, we demonstrated various vertical heterostructure devices, including quasi-2D superconducting NbSe2 Josephson junctions with atomically clean interface. The versatility of the PCL-based vdW stacking method provides a new route for assembling complex 2D vdW materials without interfacial degradation.

Research Organization:
Brookhaven National Lab. (BNL), Upton, NY (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES); National Research Foundation of Korea (NRF); Inst. for Basic Science of the Republic of Korea
Grant/Contract Number:
SC0012704; 2020R1A3B2079375; 2015K1A1A2033332; 2017R1A5A1014862; 2015R1A5A1037627; 2018R1A2A3075438; 2019M3E4A1080145; IBS-R009-G1
OSTI ID:
1658555
Report Number(s):
BNL-216335-2020-JAAM
Journal Information:
2D Materials, Vol. 7, Issue 4; ISSN 2053-1583
Publisher:
IOP PublishingCopyright Statement
Country of Publication:
United States
Language:
English

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