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Thermal neutron-induced single-event upsets in microcontrollers containing boron-10

Journal Article · · IEEE Transactions on Nuclear Science
Single-event upsets (SEUs) were measured in thermal neutron-irradiated microcontrollers with 65-nm node and 130-nm node SRAMs. The suspected upset mechanism is charge deposition from the energetic byproducts of 10B thermal neutron capture. Although elemental analysis confirmed that both microcontrollers contain 10B, only the 65-nm node microcontroller exhibited a strong response to thermal neutrons. Monte Carlo simulations were performed to investigate the effects of 11B enrichment on thermal neutron-induced SEUs in a 65-nm SRAM node when boron is present in the p-type well, p-type source and drain, or tungsten plug. Simulations indicate that the byproducts of 10B(n,α)7Li reactions are capable of generating sufficient charge to upset a 65-nm SRAM. Finally, the highest amount of charge deposition from 10B(n,α)7Li reaction byproducts occurs when natural boron is used to dope the p-type source and drain regions. Simulations also show that the SEU cross section is non-negligible when 11B-enriched boron is used for doping.
Research Organization:
Los Alamos National Laboratory (LANL), Los Alamos, NM (United States); Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
Grant/Contract Number:
89233218CNA000001; AC04-94AL85000
OSTI ID:
1574802
Alternate ID(s):
OSTI ID: 1608680
Report Number(s):
LA-UR--19-26094; SAND2019--7606J; 677058
Journal Information:
IEEE Transactions on Nuclear Science, Journal Name: IEEE Transactions on Nuclear Science Journal Issue: 1 Vol. 67; ISSN 0018-9499
Publisher:
IEEECopyright Statement
Country of Publication:
United States
Language:
English

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