skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: X-ray microdiffraction study of Cu interconnects.

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.125731· OSTI ID:15002806

No abstract prepared.

Research Organization:
Advanced Photon Source, Argonne National Lab., IL (US); Univ. of Wisconsin at Madison (US)
Sponsoring Organization:
US Department of Energy (US)
DOE Contract Number:
W-31-109-ENG-38
OSTI ID:
15002806
Journal Information:
Applied Physics Letters, Vol. 76, Issue 3; Other Information: PBD: 17 Jan 2000; Related Information: Jan. 17, 2000
Country of Publication:
United States
Language:
English

Similar Records

Measurement of strain in Al-Cu interconnect lines with x-ray microdiffraction.
Journal Article · Thu Jul 15 00:00:00 EDT 1999 · Journal of Applied Physics · OSTI ID:15002806

Quantitative nanoscale metrology study of Cu/SiO{sub 2} interconnect technology using transmission x-ray microscopy.
Journal Article · Mon Nov 20 00:00:00 EST 2000 · Applied Physics Letters · OSTI ID:15002806

Quantitative metrology study of Cu/SiO{sub 2} interconnect structures using fluorescence x-ray microscopy.
Journal Article · Mon Feb 05 00:00:00 EST 2001 · Applied Physics Letters · OSTI ID:15002806