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Title: Quantitative nanoscale metrology study of Cu/SiO{sub 2} interconnect technology using transmission x-ray microscopy.

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.1326489· OSTI ID:15002837

No abstract prepared.

Research Organization:
Advanced Photon Source, Argonne National Lab., IL (US); Univ. of Chicago; IBM T. J. Watson Research Center (US)
Sponsoring Organization:
US Department of Energy (US)
DOE Contract Number:
W-31-109-ENG-38
OSTI ID:
15002837
Journal Information:
Applied Physics Letters, Vol. 77, Issue 21; Other Information: PBD: 20 Nov 2000; Related Information: Nov. 20, 2000
Country of Publication:
United States
Language:
English