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Title: Quantitative metrology study of Cu/SiO{sub 2} interconnect structures using fluorescence x-ray microscopy.

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.1339996· OSTI ID:15002593

No abstract prepared.

Research Organization:
Advanced Photon Source, Argonne National Lab., IL (US); Univ. of Chicago; IBM T. J. Watson Research Center (US)
Sponsoring Organization:
US Department of Energy (US)
DOE Contract Number:
W-31-109-ENG-38
OSTI ID:
15002593
Journal Information:
Applied Physics Letters, Vol. 78, Issue 6; Other Information: PBD: 5 Feb 2001; Related Information: Feb. 5, 2001; ISSN 0003-6951
Country of Publication:
United States
Language:
English