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Title: Integrated packaging of multiple double sided cooling planar bond power modules

Abstract

An integrated double sided cooled power module has one or multiple phase legs configuration including one or more planar power packages, each planar power package having an upper power switch unit and a lower power switch unit directly bonded and interconnected between two insulated power substrates, and further sandwiched between two heat exchangers via direct bonds. A segmented coolant manifold is interposed with the one or more planar power packages and creates a sealed enclosure that defines a coolant inlet, a coolant outlet and a coolant flow path between the inlet and the outlet. A coolant circulates along the flow path to remove heat and increase the power density of the power module.

Inventors:
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1433849
Patent Number(s):
9,941,234
Application Number:
15/159,860
Assignee:
UT-Battelle, LLC (Oak Ridge, TN) ORNL
DOE Contract Number:  
AC05-00OR22725
Resource Type:
Patent
Resource Relation:
Patent File Date: 2016 May 20
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Liang, Zhenxian. Integrated packaging of multiple double sided cooling planar bond power modules. United States: N. p., 2018. Web.
Liang, Zhenxian. Integrated packaging of multiple double sided cooling planar bond power modules. United States.
Liang, Zhenxian. Tue . "Integrated packaging of multiple double sided cooling planar bond power modules". United States. https://www.osti.gov/servlets/purl/1433849.
@article{osti_1433849,
title = {Integrated packaging of multiple double sided cooling planar bond power modules},
author = {Liang, Zhenxian},
abstractNote = {An integrated double sided cooled power module has one or multiple phase legs configuration including one or more planar power packages, each planar power package having an upper power switch unit and a lower power switch unit directly bonded and interconnected between two insulated power substrates, and further sandwiched between two heat exchangers via direct bonds. A segmented coolant manifold is interposed with the one or more planar power packages and creates a sealed enclosure that defines a coolant inlet, a coolant outlet and a coolant flow path between the inlet and the outlet. A coolant circulates along the flow path to remove heat and increase the power density of the power module.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Apr 10 00:00:00 EDT 2018},
month = {Tue Apr 10 00:00:00 EDT 2018}
}

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Works referenced in this record:

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Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips
journal, February 2010

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