Structures and fabrication techniques for solid state electrochemical devices

Patent · Tue Oct 10 04:00:00 EDT 2006

OSTI ID:1175934

Visco, Steven J.; Jacobson, Craig P.; DeJonghe, Lutgard C.

Low-cost, mechanically strong, highly electronically conductive porous substrates and associated structures for solid-state electrochemical devices, techniques for forming these structures, and devices incorporating the structures provide solid state electrochemical device substrates of novel composition and techniques for forming thin electrode/membrane/electrolyte coatings on the novel or more conventional substrates. In particular, in one aspect the invention provides techniques for co-firing of device substrate (often an electrode) with an electrolyte or membrane layer to form densified electrolyte/membrane films 5 to 20 microns thick. In another aspect, densified electrolyte/membrane films 5 to 20 microns thick may be formed on a pre-sintered substrate by a constrained sintering process. In some cases, the substrate may be a porous metal, alloy, or non-nickel cermet incorporating one or more of the transition metals Cr, Fe and Cu, or alloys thereof.

• Research Organization: Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC03-76SF00098
• Assignee: The Regents of the University of California (Oakland, CA)
• Patent Number(s): 7,118,777
• Application Number: 11/260,009
• OSTI ID: 1175934
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE