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Title: Structures and fabrication techniques for solid state electrochemical devices

Abstract

Low-cost, mechanically strong, highly electronically conductive porous substrates and associated structures for solid-state electrochemical devices, techniques for forming these structures, and devices incorporating the structures provide solid state electrochemical device substrates of novel composition and techniques for forming thin electrode/membrane/electrolyte coatings on the novel or more conventional substrates. In particular, in one aspect the invention provides techniques for co-firing of device substrate (often an electrode) with an electrolyte or membrane layer to form densified electrolyte/membrane films 5 to 20 microns thick. In another aspect, densified electrolyte/membrane films 5 to 20 microns thick may be formed on a pre-sintered substrate by a constrained sintering process. In some cases, the substrate may be a porous metal, alloy, or non-nickel cermet incorporating one or more of the transition metals Cr, Fe and Cu, or alloys thereof.

Inventors:
; ;
Publication Date:
Research Org.:
Univ. of California, Oakland, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1175934
Patent Number(s):
7,118,777
Application Number:
11/260,009
Assignee:
The Regents of the University of California (Oakland, CA)
DOE Contract Number:  
ACO3-76SF00098
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Visco, Steven J., Jacobson, Craig P., and DeJonghe, Lutgard C. Structures and fabrication techniques for solid state electrochemical devices. United States: N. p., 2006. Web.
Visco, Steven J., Jacobson, Craig P., & DeJonghe, Lutgard C. Structures and fabrication techniques for solid state electrochemical devices. United States.
Visco, Steven J., Jacobson, Craig P., and DeJonghe, Lutgard C. 2006. "Structures and fabrication techniques for solid state electrochemical devices". United States. https://www.osti.gov/servlets/purl/1175934.
@article{osti_1175934,
title = {Structures and fabrication techniques for solid state electrochemical devices},
author = {Visco, Steven J. and Jacobson, Craig P. and DeJonghe, Lutgard C.},
abstractNote = {Low-cost, mechanically strong, highly electronically conductive porous substrates and associated structures for solid-state electrochemical devices, techniques for forming these structures, and devices incorporating the structures provide solid state electrochemical device substrates of novel composition and techniques for forming thin electrode/membrane/electrolyte coatings on the novel or more conventional substrates. In particular, in one aspect the invention provides techniques for co-firing of device substrate (often an electrode) with an electrolyte or membrane layer to form densified electrolyte/membrane films 5 to 20 microns thick. In another aspect, densified electrolyte/membrane films 5 to 20 microns thick may be formed on a pre-sintered substrate by a constrained sintering process. In some cases, the substrate may be a porous metal, alloy, or non-nickel cermet incorporating one or more of the transition metals Cr, Fe and Cu, or alloys thereof.},
doi = {},
url = {https://www.osti.gov/biblio/1175934}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2006},
month = {10}
}

Works referenced in this record:

Improved preparation procedure and properties for a multilayer piezoelectric thick-film actuator
journal, November 1998


Microstructures of Y2O3-Stabilized ZrO2 Electron Beam-Physical Vapor Deposition Coatings on Ni-Base Superalloys
journal, April 1994