Structures and fabrication techniques for solid state electrochemical devices

Patent · Tue Aug 12 00:00:00 EDT 2003

OSTI ID:1007476

Visco, Steven J ^[1]; Jacobson, Craig P ^[2]; DeJonghe, Lutgard C ^[3]

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1. Berkeley, CA
2. El Cerrito, CA
3. Lafayette, CA

Provided are low-cost, mechanically strong, highly electronically conductive porous substrates and associated structures for solid-state electrochemical devices, techniques for forming these structures, and devices incorporating the structures. The invention provides solid state electrochemical device substrates of novel composition and techniques for forming thin electrode/membrane/electrolyte coatings on the novel or more conventional substrates. In particular, in one embodiment the invention provides techniques for co-firing of device substrate (often an electrode) with an electrolyte or membrane layer to form densified electrolyte/membrane films 5 to 20 microns thick. In another embodiment, densified electrolyte/membrane films 5 to 20 microns thick may be formed on a pre-sintered substrate by a constrained sintering process. In some cases, the substrate may be a porous metal, alloy, or non-nickel cermet incorporating one or more of the transition metals Cr, Fe, Cu and Ag, or alloys thereof.

• Research Organization: University of California (Oakland, CA)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC03-76SF00098
• Assignee: The Regents of the University of California (Oakland, CA)
• Patent Number(s): 6,605,316
• Application Number: 09/626,629
• OSTI ID: 1007476
• Country of Publication: United States
• Language: English