Process for making dense thin films
Patent
·
OSTI ID:1175435
Provided are low-cost, mechanically strong, highly electronically conductive porous substrates and associated structures for solid-state electrochemical devices, techniques for forming these structures, and devices incorporating the structures. The invention provides solid state electrochemical device substrates of novel composition and techniques for forming thin electrode/membrane/electrolyte coatings on the novel or more conventional substrates. In particular, in one embodiment the invention provides techniques for firing of device substrate to form densified electrolyte/membrane films 5 to 20 microns thick. In another embodiment, densified electrolyte/membrane films 5 to 20 microns thick may be formed on a pre-sintered substrate by a constrained sintering process. In some cases, the substrate may be a porous metal, alloy, or non-nickel cermet incorporating one or more of the transition metals Cr, Fe, Cu and Ag, or alloys thereof.
- Research Organization:
- The Regents of the University of California, Oakland, CA (United States)
- Sponsoring Organization:
- USDOE
- Assignee:
- The Regents of the University of California (Oakland, CA)
- Patent Number(s):
- 6,921,557
- Application Number:
- 10/323,137
- OSTI ID:
- 1175435
- Country of Publication:
- United States
- Language:
- English
Improved preparation procedure and properties for a multilayer piezoelectric thick-film actuator
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journal | November 1998 |
Karl Marx : l'utopie, la raison et la sience
|
journal | January 1999 |
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