Embedded cluster metal-polymeric micro interface and process for producing the same

Patent · Tue Jan 29 00:00:00 EST 2002

OSTI ID:874216

Menezes, Marlon E ^[1]; Birnbaum, Howard K ^[2]; Robertson, Ian M ^[2]

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1. Santa Clara, CA
2. Champaign, IL

A micro interface between a polymeric layer and a metal layer includes isolated clusters of metal partially embedded in the polymeric layer. The exposed portion of the clusters is smaller than embedded portions, so that a cross section, taken parallel to the interface, of an exposed portion of an individual cluster is smaller than a cross section, taken parallel to the interface, of an embedded portion of the individual cluster. At least half, but not all of the height of a preferred spherical cluster is embedded. The metal layer is completed by a continuous layer of metal bonded to the exposed portions of the discontinuous clusters. The micro interface is formed by heating a polymeric layer to a temperature, near its glass transition temperature, sufficient to allow penetration of the layer by metal clusters, after isolated clusters have been deposited on the layer at lower temperatures. The layer is recooled after embedding, and a continuous metal layer is deposited upon the polymeric layer to bond with the discontinuous metal clusters.

• DOE Contract Number: 1-5-27114
• Assignee: The Board of Trustees of the University of Illinois (Urbana, IL)
• Patent Number(s): US 6342307
• Application Number: 08/976,670
• OSTI ID: 874216
• Country of Publication: United States
• Language: English

Related Subjects

embedded
cluster
metal-polymeric
micro
interface
process
producing
polymeric
layer
metal
isolated
clusters
partially
exposed
portion
portions
section
parallel
individual
half
height
spherical
completed
continuous
bonded
discontinuous
formed
heating
temperature
near
glass
transition
sufficient
allow
penetration
deposited
temperatures
recooled
embedding
bond
metal layer
glass transition
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