Method for integrating microelectromechanical devices with electronic circuitry

Patent · Thu Jan 01 00:00:00 EST 1998

OSTI ID:871797

Montague, Stephen ^[1]; Smith, James H ^[1]; Sniegowski, Jeffry J ^[1]; McWhorter, Paul J ^[1]

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1. Albuquerque, NM

A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.

• Research Organization: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 5798283
• OSTI ID: 871797
• Country of Publication: United States
• Language: English

Related Subjects

method
integrating
microelectromechanical
devices
electronic
circuitry
comprises
steps
forming
device
cavity
below
surface
substrate
encapsulating
prior
releasing
operation
fabrication
planarization
encapsulated
formation
allows
standard
processing
microelectromechanical devices
device surface
electronic circuit
method comprises
electronic circuitry
processing steps
mechanical device
standard processing
processing step
method comprise
forming electronic
integrating microelectromechanical
electromechanical devices
mechanical devices
microelectromechanical device
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