Layered devices having surface curvature and method of constructing same
Patent
·
OSTI ID:867198
- Provo, UT
A method of treating a substrate having first and second sides with corresponding oppositely facing first and second surfaces, to produce curvature in the first surface. The method includes the steps of removing material, according to a predetermined pattern, from the second side of the substrate, and applying a stress-producing film of material to at least one surface of the substrate to thereby cause the substrate to bend to produce the desired curvature in the first surface.
- Research Organization:
- Brigham Young Univ., Provo, UT (United States)
- DOE Contract Number:
- AS08-84DP40199
- Assignee:
- Brigham Young University (Provo, UT)
- Patent Number(s):
- US 4885055
- OSTI ID:
- 867198
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
layered
devices
surface
curvature
method
constructing
treating
substrate
corresponding
oppositely
facing
surfaces
produce
steps
removing
material
according
predetermined
pattern
applying
stress-producing
film
bend
desired
removing material
predetermined pattern
produce cu
oppositely facing
surface curvature
/216/359/427/430/451/
devices
surface
curvature
method
constructing
treating
substrate
corresponding
oppositely
facing
surfaces
produce
steps
removing
material
according
predetermined
pattern
applying
stress-producing
film
bend
desired
removing material
predetermined pattern
produce cu
oppositely facing
surface curvature
/216/359/427/430/451/