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Title: Patterned nanochannel sacrificial layer for semiconductor substrate reuse

Patent ·
OSTI ID:2293930

Described herein are systems and methods of utilizing nanochannels generated in the sacrificial layer of a semiconductor substrate to increase epitaxial lift-off speeds and facilitate reusability of GaAs substrates. The provided systems and methods may utilize unique nanochannel geometries to increase the surface area exposed to the etchant and further decrease etch times.

Research Organization:
National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC36-08GO28308
Assignee:
Alliance for Sustainable Energy, LLC (Golden, CO)
Patent Number(s):
11,830,733
Application Number:
17/656,762
OSTI ID:
2293930
Resource Relation:
Patent File Date: 03/28/2022
Country of Publication:
United States
Language:
English

References (6)

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Multiple release layer study of the intrinsic lateral etch rate of the epitaxial lift-off process journal November 2004
High rate epitaxial lift-off of InGaP films from GaAs substrates journal April 2000
Epitaxial lift-off process for gallium arsenide substrate reuse and flexible electronics journal March 2013
Extreme selectivity in the lift‐off of epitaxial GaAs films journal December 1987
GaAs photovoltaics and optoelectronics using releasable multilayer epitaxial assemblies journal May 2010