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Title: Jet impingement manifolds for cooling power electronics modules

Patent ·
OSTI ID:2222299
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The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.

Research Organization:
National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC36-08GO28308
Assignee:
Alliance for Sustainable Energy, LLC (Golden, CO)
Patent Number(s):
11,751,365
Application Number:
17/084,236
OSTI ID:
2222299
Resource Relation:
Patent File Date: 10/29/2020
Country of Publication:
United States
Language:
English

References (9)

Liquid cooled electronics assembly suitable to use electrically conductive coolant patent April 2014
Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages patent March 2007
Configurable double-sided modular jet impingement assemblies for electronics cooling patent May 2018
Modular jet impingement assemblies with passive and active flow control for electronics cooling patent September 2016
Two-sided jet impingement assemblies and power electronics modules comprising the same patent September 2016
Electronic assembly with phase-change cooling of a semiconductor device patent April 2019
Method and Apparatus for Flexible Fluid Delivery for Cooling Desired Hot Spots in a Heat Producing Device patent-application September 2005
Electronic Assembly with Phase-Change Cooling of a Semiconductor Device patent-application September 2018
Methods and systems for heat flux heat removal patent April 2019

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