Single-Phase Jet Impingement Cooling for a Power-Dense Silicon Carbide Power Module
The adoption of silicon carbide (SiC) devices in the electric vehicle (EV) industry is increasing due to their superior performance over silicon devices. SiC devices enable further miniaturization of EV inverters, increasing their power density, which results in thermal management challenges. Here in this paper, the limits of single-phase jet impingement cooling are explored for an automotive SiC power module. We propose embedding pin fins in the direct-bonded-copper (DBC) substrate of the power module package using laser powder bed fusion additive manufacturing. The thermalhydraulic performance of the DBC-embedded pin fins is compared against folded fins that are directly soldered to the DBC substrate. A heat conduction analysis was conducted on a SiC package to determine the target heat transfer coefficient (HTC) for the heat sink. A water-ethylene glycol (WEG) jet impingement on the proposed concepts was studied using unit-cell models to achieve the target HTC. The studied designs put emphasis on the reliability and manufacturability requirements of the automotive industry. The thermal performance of DBC-embedded pin fins outperformed the DBC-soldered folded fins. The performance of the DBC-embedded pin fins is benchmarked against WEG-based cooling systems of commercial EVs. With the proposed cooling solution, we have shown a pathway of reducing the specific thermal resistance by 75% compared to BMW i3 thermal management system without any penalty on pressure drop or parasitic power.
- Research Organization:
- National Renewable Energy Laboratory (NREL), Golden, CO (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA); Borg Warner; Binational Fulbright Commission
- Grant/Contract Number:
- AC36-08GO28308; AWD-000613
- OSTI ID:
- 1985628
- Report Number(s):
- NREL/JA-5400-82097; MainId:82870; UUID:22de7bc4-020f-4052-b2dc-68b7c8fabaed; MainAdminID:69780
- Journal Information:
- IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 13, Issue 5; ISSN 2156-3950
- Publisher:
- IEEECopyright Statement
- Country of Publication:
- United States
- Language:
- English
Similar Records
Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
Single and Double-Sided Jet Impingement Cooling for SiC-Based Power Modules