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Title: Planar electrode arrays and fabrication methods thereof

Patent ·
OSTI ID:1823812
;

The present invention relates to a method of fabricating an electrode array, in which an underlying handle wafer is removed to provide a planar device having the electrode array. Also provided are wafers including a plurality of planar devices having an electrode array, as well as sensors including such an electrode array.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
NA0003525
Assignee:
National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
Patent Number(s):
10,969,359
Application Number:
16/268,806
OSTI ID:
1823812
Resource Relation:
Patent File Date: 02/06/2019
Country of Publication:
United States
Language:
English

References (10)

Corrosion sensor patent September 2014
Polymer Frame for a Chip, Such That the Frame Comprises at Least One Via in Series with a Capacitor patent-application August 2015
Method for forming a package structure including forming a molding compound on first larger bumps surrounding a semiconductor die and second smaller bumps formed under the semiconductor die patent-application February 2018
Planar multi-electrode array sensor for localized electrochemical corrosion detection patent January 2014
Nanocomposite barrier films for photovoltaic applications patent June 2018
Nanocomposite conformal corrosion barrier coating patent December 2018
Lithographically defined microporous carbon-composite structures patent December 2016
Component packaging and assembly patent-application July 2006
Method for thinning of integrated circuit chips for lightweight packaged electronic systems patent June 1994
Wafer scale oblique angle plasma etching patent May 2017

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