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Title: Methods and apparatus for embedding heating circuits into articles made by additive manufacturing and articles made therefrom

Patent ·
OSTI ID:1805374

Methods of embedding a heating circuit in an article fabricated by additive manufacturing. The methods describe techniques such as co-extruding a wire, capable of being heated, along with print material in additive manufacturing of the article, and placing a pre-shaped wire capable of being heated between adjacent layers of the article. A third method includes dispensing a wire, capable of being heated, during the additive manufacturing of the article, and compacting the wire into the printed material. An apparatus for embedding a heating circuit in an article fabricated by additive manufacturing. The apparatus contains a wire dispenser, a cutter to control the length of the wire dispensed, and a compactor capable of embedding the wire capable of being heated into the printed material. An article made by additive manufacturing is disclosed. The article contains at least one heating element embedded in the article during the additive manufacturing process.

Research Organization:
Purdue Univ., West Lafayette, IN (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
EE0006926
Assignee:
Purdue Research Foundation (West Lafayette, IN)
Patent Number(s):
10,889,056
Application Number:
15/938,597
OSTI ID:
1805374
Resource Relation:
Patent File Date: 03/28/2018
Country of Publication:
United States
Language:
English

References (1)

Injection Molding Tool with Embedded Induction Heater patent-application October 2013