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Title: Thermally-isolated silicon-based integrated circuits and related methods

Patent ·
OSTI ID:1356199
; ; ;

Thermally isolated devices may be formed by performing a series of etches on a silicon-based substrate. As a result of the series of etches, silicon material may be removed from underneath a region of an integrated circuit (IC). The removal of the silicon material from underneath the IC forms a gap between remaining substrate and the integrated circuit, though the integrated circuit remains connected to the substrate via a support bar arrangement that suspends the integrated circuit over the substrate. The creation of this gap functions to release the device from the substrate and create a thermally-isolated integrated circuit.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC04-94AL85000
Assignee:
Sandia Corporation
Patent Number(s):
9,646,874
Application Number:
13/959,136
OSTI ID:
1356199
Resource Relation:
Patent File Date: 2013 Aug 05
Country of Publication:
United States
Language:
English

References (16)

Suspended single crystal silicon structures and method of making same patent February 1997
Microelectromechanical systems, and devices having thin film encapsulated mechanical structures patent October 2007
Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale patent March 2008
IC-compatible MEMS structure patent April 2009
Ovenized microelectromechanical system (MEMS) resonator patent March 2014
Lateral over-moded bulk acoustic resonators patent October 2015
MEMS resonators and method for manufacturing MEMS resonators patent-application October 2002
Structure of and method for fabricating electro-optic devices utilizing a compliant substrate patent-application January 2003
Method of Manufacturing a Micro-Electrical-Mechanical System with Thermally Isolated Active Elements patent-application August 2010
MEMS Sensor And Electronic Apparatus patent-application November 2010
Integration Of Piezoelectric Materials With Substrates patent-application December 2010
Micro Electronic Device And Method For Fabricating Micro Electromechanical System Resonator Thereof patent-application February 2011
Uncooled Infrared Detector And Methods For Manufacturing The Same patent-application October 2011
Integrated Circuit With MEMS Element And Manufacturing Method Thereof patent-application February 2014
CMOS-SOI-MEMS Transistor for Uncooled IR Imaging journal September 2009
Single-chip precision oscillators based on multi-frequency, high-Q aluminum nitride MEMS resonators conference June 2009

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