Flexible barrier film, method of forming same, and organic electronic device including same
A flexible barrier film has a thickness of from greater than zero to less than 5,000 nanometers and a water vapor transmission rate of no more than 1.times.10.sup.-2 g/m.sup.2/day at 22.degree. C. and 47% relative humidity. The flexible barrier film is formed from a composition, which comprises a multi-functional acrylate. The composition further comprises the reaction product of an alkoxy-functional organometallic compound and an alkoxy-functional organosilicon compound. A method of forming the flexible barrier film includes the steps of disposing the composition on a substrate and curing the composition to form the flexible barrier film. The flexible barrier film may be utilized in organic electronic devices.
- Research Organization:
- National Energy Technology Laboratory (NETL), Pittsburgh, PA, Morgantown, WV (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- FC26-05NT42344
- Assignee:
- Dow Corning Corporation (Midland, MI)
- Patent Number(s):
- 8,405,233
- Application Number:
- 13/144,362
- OSTI ID:
- 1083016
- Country of Publication:
- United States
- Language:
- English
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