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Title: Flexible barrier film, method of forming same, and organic electronic device including same

Abstract

A flexible barrier film has a thickness of from greater than zero to less than 5,000 nanometers and a water vapor transmission rate of no more than 1.times.10.sup.-2 g/m.sup.2/day at 22.degree. C. and 47% relative humidity. The flexible barrier film is formed from a composition, which comprises a multi-functional acrylate. The composition further comprises the reaction product of an alkoxy-functional organometallic compound and an alkoxy-functional organosilicon compound. A method of forming the flexible barrier film includes the steps of disposing the composition on a substrate and curing the composition to form the flexible barrier film. The flexible barrier film may be utilized in organic electronic devices.

Inventors:
; ;
Publication Date:
Research Org.:
National Energy Technology Laboratory (NETL), Pittsburgh, PA, Morgantown, WV (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1082956
Patent Number(s):
8,405,233
Application Number:
13/144,362
Assignee:
Dow Corning Corporation (Midland, MI)
DOE Contract Number:  
FC26-05NT42344
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Blizzard, John, Tonge, James Steven, and Weidner, William Kenneth. Flexible barrier film, method of forming same, and organic electronic device including same. United States: N. p., 2013. Web.
Blizzard, John, Tonge, James Steven, & Weidner, William Kenneth. Flexible barrier film, method of forming same, and organic electronic device including same. United States.
Blizzard, John, Tonge, James Steven, and Weidner, William Kenneth. 2013. "Flexible barrier film, method of forming same, and organic electronic device including same". United States. https://www.osti.gov/servlets/purl/1082956.
@article{osti_1082956,
title = {Flexible barrier film, method of forming same, and organic electronic device including same},
author = {Blizzard, John and Tonge, James Steven and Weidner, William Kenneth},
abstractNote = {A flexible barrier film has a thickness of from greater than zero to less than 5,000 nanometers and a water vapor transmission rate of no more than 1.times.10.sup.-2 g/m.sup.2/day at 22.degree. C. and 47% relative humidity. The flexible barrier film is formed from a composition, which comprises a multi-functional acrylate. The composition further comprises the reaction product of an alkoxy-functional organometallic compound and an alkoxy-functional organosilicon compound. A method of forming the flexible barrier film includes the steps of disposing the composition on a substrate and curing the composition to form the flexible barrier film. The flexible barrier film may be utilized in organic electronic devices.},
doi = {},
url = {https://www.osti.gov/biblio/1082956}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2013},
month = {3}
}