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Title: Flexible barrier film, method of forming same, and organic electronic device including same

Abstract

A flexible barrier film has a thickness of from greater than zero to less than 5,000 nanometers and a water vapor transmission rate of no more than 1.times.10.sup.-2 g/m.sup.2/day at 22.degree. C. and 47% relative humidity. The flexible barrier film is formed from a composition, which comprises a multi-functional acrylate. The composition further comprises the reaction product of an alkoxy-functional organometallic compound and an alkoxy-functional organosilicon compound. A method of forming the flexible barrier film includes the steps of disposing the composition on a substrate and curing the composition to form the flexible barrier film. The flexible barrier film may be utilized in organic electronic devices.

Inventors:
; ;
Publication Date:
Research Org.:
NETL (National Energy Technology Laboratory, Pittsburgh, PA, and Morgantown, WV (United States))
Sponsoring Org.:
USDOE
OSTI Identifier:
1082956
Patent Number(s):
8,405,233
Application Number:
13/144,362
Assignee:
Dow Corning Corporation (Midland, MI)
DOE Contract Number:  
FC26-05NT42344
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Blizzard, John, Tonge, James Steven, and Weidner, William Kenneth. Flexible barrier film, method of forming same, and organic electronic device including same. United States: N. p., 2013. Web.
Blizzard, John, Tonge, James Steven, & Weidner, William Kenneth. Flexible barrier film, method of forming same, and organic electronic device including same. United States.
Blizzard, John, Tonge, James Steven, and Weidner, William Kenneth. Tue . "Flexible barrier film, method of forming same, and organic electronic device including same". United States. https://www.osti.gov/servlets/purl/1082956.
@article{osti_1082956,
title = {Flexible barrier film, method of forming same, and organic electronic device including same},
author = {Blizzard, John and Tonge, James Steven and Weidner, William Kenneth},
abstractNote = {A flexible barrier film has a thickness of from greater than zero to less than 5,000 nanometers and a water vapor transmission rate of no more than 1.times.10.sup.-2 g/m.sup.2/day at 22.degree. C. and 47% relative humidity. The flexible barrier film is formed from a composition, which comprises a multi-functional acrylate. The composition further comprises the reaction product of an alkoxy-functional organometallic compound and an alkoxy-functional organosilicon compound. A method of forming the flexible barrier film includes the steps of disposing the composition on a substrate and curing the composition to form the flexible barrier film. The flexible barrier film may be utilized in organic electronic devices.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2013},
month = {3}
}

Patent:

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