Power electronics substrate for direct substrate cooling

Patent · Tue May 01 00:00:00 EDT 2012

OSTI ID:1044060

Le, Khiet ^[1]; Ward, Terence G ^[2]; Mann, Brooks S ^[2]; Yankoski, Edward P ^[3]; Smith, Gregory S ^[4]

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1. Mission Viejo, CA
2. Redondo Beach, CA
3. Corona, CA
4. Woodland Hills, CA

Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.

• Research Organization: GM Global Technology Operations LLC (Detroit, MI)
• Sponsoring Organization: USDOE
• DOE Contract Number: FC26-07NT43123
• Assignee: GM Global Technology Operations LLC (Detroit, MI)
• Patent Number(s): 8,169,779
• Application Number: 12/638,683
• OSTI ID: 1044060
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE