Inverter power module with distributed support for direct substrate cooling
Patent
·
OSTI ID:1062377
- San Pedro, CA
- Chino Hills, CA
- Redondo Beach, CA
Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.
- Research Organization:
- National Energy Technology Laboratory (NETL), Pittsburgh, PA, and Morgantown, WV (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- FC26-07NT43123
- Assignee:
- GM Global Technology Operations LLC (Detroit, MI)
- Patent Number(s):
- 8,248,809
- OSTI ID:
- 1062377
- Country of Publication:
- United States
- Language:
- English
Effects of surface roughness on the average heat transfer of an impinging air jet
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journal | January 2000 |
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