Diffusion-controlled decohesion using a Cu-Sn alloy as a model system
This research deals with a mode of brittle intergranular fracture in which a surface adsorbed embrittling element is driven into a grain boundary as a result of the application of a tensile stress across the boundary. A Cu-8%Sn alloy has been employed to explore this phenomenon, since tin is a surface-active element, and this alloy is known to suffer intergranular weakness at elevated temperatures. Intergranular cracking occurred by brittle, discontinuous crack advance at 265{degrees}C in vacuum with an average rate of 0.1{mu}m/sec. This behavior is analogous to sulfur-induced stress-relief cracking in steels and several cases of liquid-metal embrittlement, suggesting that this phenomenon has a generic nature.
- Research Organization:
- Pennsylvania Univ., Philadelphia, PA (United States). Dept. of Materials Science and Engineering
- Sponsoring Organization:
- USDOE, Washington, DC (United States); National Science Foundation, Washington, DC (United States)
- DOE Contract Number:
- FG02-87ER45290
- OSTI ID:
- 10138576
- Report Number(s):
- CONF-911202-71; ON: DE92011645
- Resource Relation:
- Conference: Annual fall meeting of the Materials Research Society (MRS),Boston, MA (United States),2-6 Dec 1991; Other Information: PBD: [1991]
- Country of Publication:
- United States
- Language:
- English
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Quasi-static intergranular cracking in a Cu-Sn alloy: An analog of stress relief cracking of steels
Quasi-static intergranular cracking in a Cu-Sn alloy: An analog of stress relief cracking of steels