Diffusion-controlled decohesion using a Cu-Sn alloy as a model system
This research deals with a mode of brittle intergranular fracture in which a surface adsorbed embrittling element is driven into a grain boundary as a result of the application of a tensile stress across the boundary. A Cu-8%Sn alloy has been employed to explore this phenomenon, since tin is a surface-active element, and this alloy is known to suffer intergranular weakness at elevated temperatures. Intergranular cracking occurred by brittle, discontinuous crack advance at 265{degrees}C in vacuum with an average rate of 0.1{mu}m/sec. This behavior is analogous to sulfur-induced stress-relief cracking in steels and several cases of liquid-metal embrittlement, suggesting that this phenomenon has a generic nature.
- Research Organization:
- Pennsylvania Univ., Philadelphia, PA (United States). Dept. of Materials Science and Engineering
- Sponsoring Organization:
- USDOE; National Science Foundation (NSF); USDOE, Washington, DC (United States); National Science Foundation, Washington, DC (United States)
- DOE Contract Number:
- FG02-87ER45290
- OSTI ID:
- 5465930
- Report Number(s):
- CONF-911202-71; ON: DE92011645
- Resource Relation:
- Conference: Annual fall meeting of the Materials Research Society, Boston, MA (United States), 2-6 Dec 1991
- Country of Publication:
- United States
- Language:
- English
Similar Records
Quasi-static intergranular cracking in a Cu-Sn alloy: An analog of stress relief cracking of steels
Quasi-static intergranular cracking in a Cu-Sn alloy: An analog of stress relief cracking of steels
Related Subjects
COPPER BASE ALLOYS
EMBRITTLEMENT
GRAIN BOUNDARIES
TIN ALLOYS
CRACKS
DIFFUSION
FRACTURE PROPERTIES
TEMPERATURE DEPENDENCE
ALLOYS
COPPER ALLOYS
CRYSTAL STRUCTURE
MECHANICAL PROPERTIES
MICROSTRUCTURE
360103* - Metals & Alloys- Mechanical Properties
360102 - Metals & Alloys- Structure & Phase Studies