Diffusion-controlled decohesion using a Cu-Sn alloy as a model system

Conference · Tue Jan 01 04:00:00 EST 1991

OSTI ID:5465930

Bika, D; McMahon, Jr, C J

This research deals with a mode of brittle intergranular fracture in which a surface adsorbed embrittling element is driven into a grain boundary as a result of the application of a tensile stress across the boundary. A Cu-8%Sn alloy has been employed to explore this phenomenon, since tin is a surface-active element, and this alloy is known to suffer intergranular weakness at elevated temperatures. Intergranular cracking occurred by brittle, discontinuous crack advance at 265{degrees}C in vacuum with an average rate of 0.1{mu}m/sec. This behavior is analogous to sulfur-induced stress-relief cracking in steels and several cases of liquid-metal embrittlement, suggesting that this phenomenon has a generic nature.

• Research Organization: Pennsylvania Univ., Philadelphia, PA (United States). Dept. of Materials Science and Engineering
• Sponsoring Organization: DOE; NSF; USDOE, Washington, DC (United States); National Science Foundation, Washington, DC (United States)
• DOE Contract Number: FG02-87ER45290
• OSTI ID: 5465930
• Report Number(s): CONF-911202-71; ON: DE92011645
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360102 -- Metals & Alloys-- Structure & Phase Studies
360103* -- Metals & Alloys-- Mechanical Properties
ALLOYS
COPPER ALLOYS
COPPER BASE ALLOYS
CRACKS
CRYSTAL STRUCTURE
DIFFUSION
EMBRITTLEMENT
FRACTURE PROPERTIES
GRAIN BOUNDARIES
MECHANICAL PROPERTIES
MICROSTRUCTURE
TEMPERATURE DEPENDENCE
TIN ALLOYS