Integrated three-dimensional module heat exchanger for power electronics cooling
Patent
·
OSTI ID:1096006
Embodiments discussed herein are directed to a power semiconductor packaging that removes heat from a semiconductor package through one or more cooling zones that are located in a laterally oriented position with respect to the semiconductor package. Additional embodiments are directed to circuit elements that are constructed from one or more modular power semiconductor packages.
- Research Organization:
- National Renewable Energy Laboratory (NREL), Golden, CO (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC36-08GO28308
- Assignee:
- Alliance for Sustainable Energy, LLC (Golden, CO)
- Patent Number(s):
- 8,541,875
- Application Number:
- 13/249,706
- OSTI ID:
- 1096006
- Country of Publication:
- United States
- Language:
- English
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