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Title: Integrated three-dimensional module heat exchanger for power electronics cooling

Embodiments discussed herein are directed to a power semiconductor packaging that removes heat from a semiconductor package through one or more cooling zones that are located in a laterally oriented position with respect to the semiconductor package. Additional embodiments are directed to circuit elements that are constructed from one or more modular power semiconductor packages.
Authors:
;
Publication Date:
OSTI Identifier:
1096006
Report Number(s):
8,541,875
13/249,706
DOE Contract Number:
AC36-08GO28308
Resource Type:
Patent
Research Org:
NREL (National Renewable Energy Laboratory (NREL), Golden, CO (United States))
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING