Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Pahinkar, Darshan; Boteler, Lauren; Ibitayo, Dimeji; Narumanchi, Sreekant; Paret, Paul; DeVoto, Douglas; Major, Joshua; Graham, Samuel

doi:10.1115/1.4043406

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Journal Article · Wed May 08 00:00:00 EDT 2019 · Journal of Electronic Packaging

DOI:https://doi.org/10.1115/1.4043406· OSTI ID:1507288

Pahinkar, Darshan ^[1]; Boteler, Lauren ^[2]; Ibitayo, Dimeji ^[2]; Narumanchi, Sreekant ^[3]; Paret, Paul ^[3]; DeVoto, Douglas ^[3]; Major, Joshua ^[3]; Graham, Samuel ^[1]

Georgia Inst. of Technology, Atlanta, GA (United States)
Army Research Lab., Adelphi, MD (United States)
National Renewable Energy Lab. (NREL), Golden, CO (United States)

With recent advances in the state-of-the-art of power electronic devices, packaging has become one of the critical factors limiting the performance and durability of power electronics. To this end, this study investigates the feasibility of a novel integrated package assembly, which consists of copper circuit layer on an aluminum nitride (AlN) dielectric layer that is bonded to an aluminum silicon carbide (AlSiC) substrate. The entire assembly possesses a low coefficient of thermal expansion (CTE) mismatch which aids in the thermal cycling reliability of the structure. The new assembly can serve as a replacement for the conventionally used direct bonded copper (DBC) - Cu base plate - Al heat sink assembly. While improvements in thermal cycling stability of more than a factor of 18 has been demonstrated, the use of AlSiC can result in increased thermal resistance when compared to thick copper heat spreaders. To address this issue, we demonstrate that the integration of single phase liquid cooling in the AlSiC layer can result in improved thermal performance, matching that of copper heat spreading layers. This is aided by the use of heat transfer enhancement features built into the AlSiC layer. It is found that, for a given pumping power and through analytical optimization of geometries, either microchannels, pin fins and jets can be designed to yield a heat transfer coefficients of up to 65000 W m^-2 K^-1, which can result in competitive device temperatures as Cu-baseplate designs, but with added reliability.

View Accepted Manuscript (DOE)

Research Organization:: National Renewable Energy Laboratory (NREL), Golden, CO (United States)

Sponsoring Organization:: USDOE National Renewable Energy Laboratory (NREL), Laboratory Directed Research and Development (LDRD) Program

Grant/Contract Number:: AC36-08GO28308

OSTI ID:: 1507288

Report Number(s):: NREL/JA--5400-71792

Journal Information:: Journal of Electronic Packaging, Journal Name: Journal of Electronic Packaging Journal Issue: 4 Vol. 141; ISSN 1043-7398

Publisher:: ASMECopyright Statement

Country of Publication:: United States

Language:: English

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30 DIRECT ENERGY CONVERSION
47 OTHER INSTRUMENTATION
aluminum
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Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

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