Heat Pipe Embedded AlSiC Plates for High Conductivity - Low CTE Heat Spreaders

Conference · Thu Jan 07 04:00:00 EST 2010

OSTI ID:1074137

Johnson, Matthew ^[1]; Weyant, J; Garner, S ^[2]; Occhionero, M ^[3]

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1. DOE/NNSA Kansas City Plant (United States)
2. Advanced Cooling Technologies, Inc. (Lancaster, PA (United States))
3. CPS Technologies Corporation, Norton, MA (United States)

Heat pipe embedded aluminum silicon carbide (AlSiC) plates are innovative heat spreaders that provide high thermal conductivity and low coefficient of thermal expansion (CTE). Since heat pipes are two phase devices, they demonstrate effective thermal conductivities ranging between 50,000 and 200,000 W/m-K, depending on the heat pipe length. Installing heat pipes into an AlSiC plate dramatically increases the plate’s effective thermal conductivity. AlSiC plates alone have a thermal conductivity of roughly 200 W/m-K and a CTE ranging from 7-12 ppm/ deg C, similar to that of silicon. An equivalent sized heat pipe embedded AlSiC plate has effective thermal conductivity ranging from 400 to 500 W/m-K and retains the CTE of AlSiC.

• Research Organization: Kansas City Plant (KCP), Kansas City, MO (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• DOE Contract Number: AC04-01AL66850
• OSTI ID: 1074137
• Report Number(s): KCP-613-8705
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
High Thermal Conductivity
Heat Spreader
Low Coefficient of Thermal Expansion (CTE)
Vapor Chamber
Electronics Cooling
Heat Pipe