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Transient Liquid Phase Bonding of AlN to AlSiC for Durable Power Electronic Packages

Journal Article · · Advanced Engineering Materials
 [1];  [1];  [1];  [2];  [2];  [3];  [3];  [3];  [3]
  1. Georgia Inst. of Technology, Atlanta, GA (United States)
  2. Army Research Lab., Adelphi, MD (United States)
  3. National Renewable Energy Lab. (NREL), Golden, CO (United States)
+ Show Author Affiliations
Conventional power electronic modules employ a direct bonded copper (DBC) substrate and multiple interface layers to dissipate heat. However, reliability issues arise due to the coefficient of thermal expansion (CTE) mismatch that exists between the metal, ceramic, and semiconductor materials in the conventional module. Significant performance enhancement can be achieved by eliminating the DBC and developing an integrated substrate/cold plate with a low CTE mismatch throughout the package. To address this need, we have demonstrated the ability to directly bond the aluminum nitride (AlN) substrate to an AlSiC heat sink through transient liquid phase bonding using a Cu-Al binary system. Fabricated samples are found to have good interfacial adhesion. The novel bond material exhibits properties analogous to AlSiC and is analyzed for thermal, mechanical, and metallographic properties. The novel structure demonstrated in this work will enable smaller, lighter, and more reliable power modules, when compared to traditional configurations.
Research Organization:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Organization:
USDOE
Grant/Contract Number:
AC36-08GO28308
OSTI ID:
1479868
Report Number(s):
NREL/JA--5400-71786
Journal Information:
Advanced Engineering Materials, Journal Name: Advanced Engineering Materials Journal Issue: 10 Vol. 20; ISSN 1438-1656
Publisher:
WileyCopyright Statement
Country of Publication:
United States
Language:
English

References (8)

Direct bonding of copper to aluminum nitride journal July 1996
Dependency of the thermal and electrical conductivity on the temperature and composition of Cu in the Al based Al–Cu alloys journal November 2010
Thermal fatigue and failure of electronic power device substrates journal November 2009
Understanding AlN sintering through computational thermodynamics combined with experimental investigation journal April 2005
Structural, elastic and electronic properties of θ (Al2Cu) and S (Al2CuMg) strengthening precipitates in Al–Cu–Mg series alloys: First-principles calculations journal December 2012
Pulse Method of Measuring Thermal Diffusivity at High Temperatures journal April 1963
Surface Preparation of Aluminum Nitride for Metallization: Effect of Temperature on Surface Reactivity journal September 2005
Transient Liquid Phase Bonding journal August 1992

Cited By (1)

Thermal management applied laminar composites with SiC nanowires enhanced interface bonding strength and thermal conductivity journal January 2019

Figures / Tables (13)

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Related Subjects

42 ENGINEERING
characterization
power electronics
thermal management
transient liquid phase bonding