Transient Liquid Phase Bonding of AlN to AlSiC for Durable Power Electronic Packages

Pahinkar, Darshan G.; Puckett, Waylon; Graham, Samuel; Boteler, Lauren; Ibitayo, Dimeji; Narumanchi, Sreekant; Paret, Paul; DeVoto, Douglas; Major, Joshua

doi:10.1002/adem.201800039

Title: Transient Liquid Phase Bonding of AlN to AlSiC for Durable Power Electronic Packages

Journal Article · Tue Jun 12 00:00:00 EDT 2018 · Advanced Engineering Materials

DOI:https://doi.org/10.1002/adem.201800039· OSTI ID:1479868

Pahinkar, Darshan G. ^[1]; Puckett, Waylon ^[1]; Graham, Samuel ^[1]; Boteler, Lauren ^[2]; Ibitayo, Dimeji ^[2]; Narumanchi, Sreekant ^[3]; Paret, Paul ^[3]; DeVoto, Douglas ^[3]; Major, Joshua ^[3]

Georgia Inst. of Technology, Atlanta, GA (United States)
Army Research Lab., Adelphi, MD (United States)
National Renewable Energy Lab. (NREL), Golden, CO (United States)

Conventional power electronic modules employ a direct bonded copper (DBC) substrate and multiple interface layers to dissipate heat. However, reliability issues arise due to the coefficient of thermal expansion (CTE) mismatch that exists between the metal, ceramic, and semiconductor materials in the conventional module. Significant performance enhancement can be achieved by eliminating the DBC and developing an integrated substrate/cold plate with a low CTE mismatch throughout the package. To address this need, we have demonstrated the ability to directly bond the aluminum nitride (AlN) substrate to an AlSiC heat sink through transient liquid phase bonding using a Cu-Al binary system. Fabricated samples are found to have good interfacial adhesion. The novel bond material exhibits properties analogous to AlSiC and is analyzed for thermal, mechanical, and metallographic properties. The novel structure demonstrated in this work will enable smaller, lighter, and more reliable power modules, when compared to traditional configurations.

View Accepted Manuscript (DOE)

Cite

Export

Save

Research Organization:: National Renewable Energy Lab. (NREL), Golden, CO (United States)

Sponsoring Organization:: USDOE

Grant/Contract Number:: AC36-08GO28308

OSTI ID:: 1479868

Report Number(s):: NREL/JA-5400-71786

Journal Information:: Advanced Engineering Materials, Vol. 20, Issue 10; ISSN 1438-1656

Publisher:: WileyCopyright Statement

Country of Publication:: United States

Language:: English

Citation Metrics:

Cited by: 10 works

Citation information provided by
Web of Science

References (8)

Structural, elastic and electronic properties of θ (Al2Cu) and S (Al2CuMg) strengthening precipitates in Al–Cu–Mg series alloys: First-principles calculations Zhang, J.; Huang, Y. N.; Mao, C. Solid State Communications, Vol. 152, Issue 23 https://doi.org/10.1016/j.ssc.2012.09.003	journal	December 2012
Direct bonding of copper to aluminum nitride Entezarian, M.; Drew, R. A. L. Materials Science and Engineering: A, Vol. 212, Issue 2 https://doi.org/10.1016/0921-5093(96)10190-8	journal	July 1996
Understanding AlN sintering through computational thermodynamics combined with experimental investigation Medraj, M.; Baik, Y.; Thompson, W. T. Journal of Materials Processing Technology, Vol. 161, Issue 3 https://doi.org/10.1016/j.jmatprotec.2004.05.031	journal	April 2005
Surface Preparation of Aluminum Nitride for Metallization: Effect of Temperature on Surface Reactivity Deitch, C.; Crawford, A.; Meier, A. Materials and Manufacturing Processes, Vol. 20, Issue 5 https://doi.org/10.1081/AMP-200060371	journal	September 2005
Dependency of the thermal and electrical conductivity on the temperature and composition of Cu in the Al based Al–Cu alloys Aksöz, S.; Ocak, Y.; Maraşlı, N. Experimental Thermal and Fluid Science, Vol. 34, Issue 8 https://doi.org/10.1016/j.expthermflusci.2010.07.015	journal	November 2010
Thermal fatigue and failure of electronic power device substrates Pietranico, S.; Pommier, S.; Lefebvre, S. International Journal of Fatigue, Vol. 31, Issue 11-12 https://doi.org/10.1016/j.ijfatigue.2009.03.011	journal	November 2009
Transient Liquid Phase Bonding MacDonald, W. D.; Eagar, T. W. Annual Review of Materials Science, Vol. 22, Issue 1 https://doi.org/10.1146/annurev.ms.22.080192.000323	journal	August 1992
Pulse Method of Measuring Thermal Diffusivity at High Temperatures Cowan, Robert D. Journal of Applied Physics, Vol. 34, Issue 4 https://doi.org/10.1063/1.1729564	journal	April 1963

Cited By (1)

Thermal management applied laminar composites with SiC nanowires enhanced interface bonding strength and thermal conductivity Chang, Jing; Zhang, Qiang; Lin, Yingfei Nanoscale, Vol. 11, Issue 34 https://doi.org/10.1039/c9nr04644e	journal	January 2019