Fracture resistance of hierarchical Cu–Mo nanocomposite thin films
Abstract
We report the fracture behavior of high-temperature co-sputtered Cu/Mo nanocomposite thin films was investigated through in situ 3-point bend testing of pre-notched microbeams in SEM. The as-synthesized nanocomposites present hierarchical nano/microstructures composed of a matrix of phase-separated Cu–Mo with nanoscale ligaments dispersed with sub-micron scale Cu-rich islands containing Mo nano-precipitates. Results show a significant crack growth resistance in the hierarchical nanocomposite, several times higher than that measured in Cu/Mo nanoscale multilayers. Based on electron microscopy characterization, three mechanisms of crack growth resistance in the hierarchical structures are proposed: crack bridging by the Cu-rich layer, crack deflection via shear along the Cu/Mo interface, and multiple cracking. This work demonstrates an approach to increase toughness in high strength nanocomposites through interface micro-structure design.
- Authors:
-
[1];
[2];
- University of Michigan, Ann Arbor, MI (United States)
- Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
- Publication Date:
- Research Org.:
- Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
- Sponsoring Org.:
- USDOE National Nuclear Security Administration (NNSA); USDOE Office of Science (SC), Basic Energy Sciences (BES); National Science Foundation (NSF)
- OSTI Identifier:
- 1875794
- Alternate Identifier(s):
- OSTI ID: 1811056
- Report Number(s):
- LA-UR-20-26907
Journal ID: ISSN 0921-5093
- Grant/Contract Number:
- 89233218CNA000001
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing
- Additional Journal Information:
- Journal Volume: 799; Journal ID: ISSN 0921-5093
- Publisher:
- Elsevier
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; hierarchical nanocomposite; fracture toughness; In situ 3-point bend; nanomechanics; thin film
Citation Formats
Cui, Yuchi, Derby, Benjamin, Li, Nan, and Misra, Amit. Fracture resistance of hierarchical Cu–Mo nanocomposite thin films. United States: N. p., 2020.
Web. doi:10.1016/j.msea.2020.139891.
Cui, Yuchi, Derby, Benjamin, Li, Nan, & Misra, Amit. Fracture resistance of hierarchical Cu–Mo nanocomposite thin films. United States. https://doi.org/10.1016/j.msea.2020.139891
Cui, Yuchi, Derby, Benjamin, Li, Nan, and Misra, Amit. Tue .
"Fracture resistance of hierarchical Cu–Mo nanocomposite thin films". United States. https://doi.org/10.1016/j.msea.2020.139891. https://www.osti.gov/servlets/purl/1875794.
@article{osti_1875794,
title = {Fracture resistance of hierarchical Cu–Mo nanocomposite thin films},
author = {Cui, Yuchi and Derby, Benjamin and Li, Nan and Misra, Amit},
abstractNote = {We report the fracture behavior of high-temperature co-sputtered Cu/Mo nanocomposite thin films was investigated through in situ 3-point bend testing of pre-notched microbeams in SEM. The as-synthesized nanocomposites present hierarchical nano/microstructures composed of a matrix of phase-separated Cu–Mo with nanoscale ligaments dispersed with sub-micron scale Cu-rich islands containing Mo nano-precipitates. Results show a significant crack growth resistance in the hierarchical nanocomposite, several times higher than that measured in Cu/Mo nanoscale multilayers. Based on electron microscopy characterization, three mechanisms of crack growth resistance in the hierarchical structures are proposed: crack bridging by the Cu-rich layer, crack deflection via shear along the Cu/Mo interface, and multiple cracking. This work demonstrates an approach to increase toughness in high strength nanocomposites through interface micro-structure design.},
doi = {10.1016/j.msea.2020.139891},
journal = {Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing},
number = ,
volume = 799,
place = {United States},
year = {Tue Jul 07 00:00:00 EDT 2020},
month = {Tue Jul 07 00:00:00 EDT 2020}
}
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