Effects of particle inclusions on cracking in ultrathin barrier films

Singh, Ankit Kumar; Kim, Kyungjin; Chou, Wen-Fang; Jia, Xiaojia; Fuentes-Hernandez, Canek; Kippelen, Bernard; Graham, Samuel

doi:10.1016/j.tsf.2020.138387

Title: Effects of particle inclusions on cracking in ultrathin barrier films

Abstract

Here, the effects of particle inclusions with different mechanical properties on the development of cracks in ultra-thin barrier films have been studied. Two types of particles, alumina and poly(styrene-b-methyl methacrylate) with large differences in their elastic modulus were used, representing both hard and soft inclusions. Particles were seeded onto polyethylene naphthalate substrates and subsequently coated with atomic layer deposited Al₂O₃ as a barrier film. Ca corrosion tests used to determine the performance of the barrier films revealed that soft polymer particle inclusions severely affect the development of cracking in barrier films as compared to stiff ceramic particles. Tensile tests also confirmed that the barrier films with polymer particle inclusions have the lowest value of critical onset strain. Parametric simulations, conducted by varying the elastic modulus of the particle inclusions over a wide range, resulted in a larger strain energy release rate near particle inclusions which promotes crack formation and negatively impacts the performance of barrier films with softer particle inclusions. Thus, the combination of high residual stresses in the barrier films with the presence of soft particle inclusions is found the most detrimental for the development of high-performance ultrathin barrier films.

Authors:

^[1]; Kim, Kyungjin ^[1]; Chou, Wen-Fang ^[1]; Jia, Xiaojia ^[1]; Fuentes-Hernandez, Canek ^[1];

^[1]; Graham, Samuel ^[1]

Georgia Institute of Technology, Atlanta, GA (United States)

Publication Date:: Mon Oct 12 00:00:00 EDT 2020

Research Org.:: North Carolina State University, Raleigh, NC (United States)

Sponsoring Org.:: USDOE National Nuclear Security Administration (NNSA); US Department of the Navy, Office of Naval Research (ONR); US Air Force Office of Scientific Research (AFOSR)

OSTI Identifier:: 1850341

Alternate Identifier(s):: OSTI ID: 1776248

Grant/Contract Number:: NA0002576; N00014-14-1-0580; N00014-16-1-2520; FA9550-16-1-0168

Resource Type:: Accepted Manuscript

Journal Name:: Thin Solid Films

Additional Journal Information:: Journal Volume: 714; Journal Issue: C; Journal ID: ISSN 0040-6090

Publisher:: Elsevier

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE; 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; materials science; physics; atomic layer deposition; ultrathin barrier films; cracks; particle inclusion; particle contamination

Citation Formats


                    Singh, Ankit Kumar, Kim, Kyungjin, Chou, Wen-Fang, Jia, Xiaojia, Fuentes-Hernandez, Canek, Kippelen, Bernard, and Graham, Samuel. Effects of particle inclusions on cracking in ultrathin barrier films.  United States: N. p., 2020. 
Web.  doi:10.1016/j.tsf.2020.138387.

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                    Singh, Ankit Kumar, Kim, Kyungjin, Chou, Wen-Fang, Jia, Xiaojia, Fuentes-Hernandez, Canek, Kippelen, Bernard, & Graham, Samuel. Effects of particle inclusions on cracking in ultrathin barrier films.  United States.  https://doi.org/10.1016/j.tsf.2020.138387

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                    Singh, Ankit Kumar, Kim, Kyungjin, Chou, Wen-Fang, Jia, Xiaojia, Fuentes-Hernandez, Canek, Kippelen, Bernard, and Graham, Samuel. Mon .  
"Effects of particle inclusions on cracking in ultrathin barrier films".  United States.  https://doi.org/10.1016/j.tsf.2020.138387.  https://www.osti.gov/servlets/purl/1850341.

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@article{osti_1850341,

  title        = {Effects of particle inclusions on cracking in ultrathin barrier films},

  author       = {Singh, Ankit Kumar and Kim, Kyungjin and Chou, Wen-Fang and Jia, Xiaojia and Fuentes-Hernandez, Canek and Kippelen, Bernard and Graham, Samuel},

  abstractNote = {Here, the effects of particle inclusions with different mechanical properties on the development of cracks in ultra-thin barrier films have been studied. Two types of particles, alumina and poly(styrene-b-methyl methacrylate) with large differences in their elastic modulus were used, representing both hard and soft inclusions. Particles were seeded onto polyethylene naphthalate substrates and subsequently coated with atomic layer deposited Al2O3 as a barrier film. Ca corrosion tests used to determine the performance of the barrier films revealed that soft polymer particle inclusions severely affect the development of cracking in barrier films as compared to stiff ceramic particles. Tensile tests also confirmed that the barrier films with polymer particle inclusions have the lowest value of critical onset strain. Parametric simulations, conducted by varying the elastic modulus of the particle inclusions over a wide range, resulted in a larger strain energy release rate near particle inclusions which promotes crack formation and negatively impacts the performance of barrier films with softer particle inclusions. Thus, the combination of high residual stresses in the barrier films with the presence of soft particle inclusions is found the most detrimental for the development of high-performance ultrathin barrier films.},

  doi          = {10.1016/j.tsf.2020.138387},

  journal      = {Thin Solid Films},

  number       = C,

  volume       = 714,

  place        = {United States},

  year         = {Mon Oct 12 00:00:00 EDT 2020},

  month        = {Mon Oct 12 00:00:00 EDT 2020}

}

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Title: Effects of particle inclusions on cracking in ultrathin barrier films

Abstract

Citation Formats

High operational and environmental stability of high-mobility conjugated polymer field-effect transistors through the use of molecular additives journal, December 2016

Water permeation through organic–inorganic multilayer thin films journal, August 2012

A hybrid encapsulation method for organic electronics journal, April 2009

Fracture toughness measurement of ultra-thin hard films deposited on a polymer interlayer journal, January 2014

Cracking of thin bonded films in residual tension journal, January 1992

Environmentally Assisted Cracking in Silicon Nitride Barrier Films on Poly(ethylene terephthalate) Substrates journal, September 2016

Organic materials for printed electronics journal, January 2007

Low-temperature gas-barrier films by atomic layer deposition for encapsulating organic light-emitting diodes journal, June 2016

Gas diffusion barriers on polymers using Al2O3 atomic layer deposition journal, January 2006

Three-dimensional effects in thin film fracture mechanics journal, March 1992

Gas permeation and lifetime tests on polymer-based barrier coatings conference, February 2001

Mixed Mode Cracking in Layered Materials book, January 1991

Damage-free hybrid encapsulation of organic field-effect transistors to reduce environmental instability journal, January 2012

Channel cracking in thin films on substrates of finite thickness journal, January 2003

Low-Temperature Plasma-Assisted Atomic Layer Deposition of Silicon Nitride Moisture Permeation Barrier Layers journal, September 2015

Al 2 O 3 /ZrO 2 Nanolaminates as Ultrahigh Gas-Diffusion Barriers-A Strategy for Reliable Encapsulation of Organic Electronics journal, May 2009

Recent Progress in Organic Electronics: Materials, Devices, and Processes journal, November 2004

Enhanced moisture barrier performance for ALD-encapsulated OLEDs by introducing an organic protective layer journal, January 2017

Recent progress on thin-film encapsulation technologies for organic electronic devices journal, March 2016

Flexible organic electronic devices: Materials, process and applications journal, August 2008

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Permeability and corrosion in ZrO 2 /Al 2 O 3 nanolaminate and Al 2 O 3 thin films grown by atomic layer deposition on polymers journal, July 2012

Engineering the mechanical properties of ultrabarrier films grown by atomic layer deposition for the encapsulation of printed electronics journal, August 2015

A Path Independent Integral and the Approximate Analysis of Strain Concentration by Notches and Cracks journal, June 1968

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Stable organic thin-film transistors journal, January 2018

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Molecular Mechanisms of Aluminum Oxide Thin Film Growth on Polystyrene during Atomic Layer Deposition journal, November 2010

Atomic layer deposited TiO /AlO nanolaminates as moisture barriers for organic devices journal, November 2016

Ca test of Al2O3 gas diffusion barriers grown by atomic layer deposition on polymers journal, July 2006

On the role of nanoporosity in controlling the performance of moisture permeation barrier layers journal, April 2014

Gas diffusion ultrabarriers on polymer substrates using Al2O3 atomic layer deposition and SiN plasma-enhanced chemical vapor deposition journal, July 2009

P-88: Thin Film Encapsulation for OLEDs: Evaluation of Multi-layer Barriers using the Ca Test journal, January 2003

Note: A single specimen channel crack growth technique applied to brittle thin films on polymer substrates journal, March 2017

Method for Aluminum Oxide Thin Films Prepared through Low Temperature Atomic Layer Deposition for Encapsulating Organic Electroluminescent Devices journal, February 2015

Fracture Mechanics and Oxygen Gas Barrier Properties of Al2O3/ZnO Nanolaminates on PET Deposited by Atomic Layer Deposition journal, January 2019

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Thin-Film Permeation-Barrier Technology for Flexible Organic Light-Emitting Devices journal, January 2004

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Experimental investigation of defect-assisted and intrinsic water vapor permeation through ultrabarrier films journal, March 2016

High operational and environmental stability of high-mobility conjugated polymer field-effect transistors through the use of molecular additives
journal, December 2016

Water permeation through organic–inorganic multilayer thin films
journal, August 2012

A hybrid encapsulation method for organic electronics
journal, April 2009

Fracture toughness measurement of ultra-thin hard films deposited on a polymer interlayer
journal, January 2014

Cracking of thin bonded films in residual tension
journal, January 1992

Environmentally Assisted Cracking in Silicon Nitride Barrier Films on Poly(ethylene terephthalate) Substrates
journal, September 2016

Organic materials for printed electronics
journal, January 2007

Low-temperature gas-barrier films by atomic layer deposition for encapsulating organic light-emitting diodes
journal, June 2016

Gas diffusion barriers on polymers using Al2O3 atomic layer deposition
journal, January 2006

Three-dimensional effects in thin film fracture mechanics
journal, March 1992

Gas permeation and lifetime tests on polymer-based barrier coatings
conference, February 2001

Mixed Mode Cracking in Layered Materials
book, January 1991

Damage-free hybrid encapsulation of organic field-effect transistors to reduce environmental instability
journal, January 2012

Channel cracking in thin films on substrates of finite thickness
journal, January 2003

Low-Temperature Plasma-Assisted Atomic Layer Deposition of Silicon Nitride Moisture Permeation Barrier Layers
journal, September 2015

Al ₂ O ₃ /ZrO ₂ Nanolaminates as Ultrahigh Gas-Diffusion Barriers-A Strategy for Reliable Encapsulation of Organic Electronics
journal, May 2009

Recent Progress in Organic Electronics: Materials, Devices, and Processes
journal, November 2004

Enhanced moisture barrier performance for ALD-encapsulated OLEDs by introducing an organic protective layer
journal, January 2017

Recent progress on thin-film encapsulation technologies for organic electronic devices
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Flexible organic electronic devices: Materials, process and applications
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journal, December 2003

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journal, July 2012

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journal, August 2015

A Path Independent Integral and the Approximate Analysis of Strain Concentration by Notches and Cracks
journal, June 1968

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journal, January 2007

Stable organic thin-film transistors
journal, January 2018

Recent progress in organic photovoltaics: device architecture and optical design
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Growth of thin barrier films on flexible polymer substrates by atomic layer deposition
journal, February 2017

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journal, September 2014

Stability/degradation of polymer solar cells
journal, July 2008

Atomic Layer Deposition: An Overview
journal, January 2010

Defect-permeation correlation for ultrathin transparent barrier coatings on polymers
journal, January 2000

Molecular Mechanisms of Aluminum Oxide Thin Film Growth on Polystyrene during Atomic Layer Deposition
journal, November 2010

Atomic layer deposited TiO /AlO nanolaminates as moisture barriers for organic devices
journal, November 2016

Ca test of Al2O3 gas diffusion barriers grown by atomic layer deposition on polymers
journal, July 2006

On the role of nanoporosity in controlling the performance of moisture permeation barrier layers
journal, April 2014

Gas diffusion ultrabarriers on polymer substrates using Al2O3 atomic layer deposition and SiN plasma-enhanced chemical vapor deposition
journal, July 2009

P-88: Thin Film Encapsulation for OLEDs: Evaluation of Multi-layer Barriers using the Ca Test
journal, January 2003

Note: A single specimen channel crack growth technique applied to brittle thin films on polymer substrates
journal, March 2017

Method for Aluminum Oxide Thin Films Prepared through Low Temperature Atomic Layer Deposition for Encapsulating Organic Electroluminescent Devices
journal, February 2015

Fracture Mechanics and Oxygen Gas Barrier Properties of Al2O3/ZnO Nanolaminates on PET Deposited by Atomic Layer Deposition
journal, January 2019

Al ₂ O ₃ /TiO ₂ Nanolaminate Thin Film Encapsulation for Organic Thin Film Transistors via Plasma-Enhanced Atomic Layer Deposition
journal, April 2014

Atomic layer deposition for photovoltaics: applications and prospects for solar cell manufacturing
journal, June 2012

Thin-Film Permeation-Barrier Technology for Flexible Organic Light-Emitting Devices
journal, January 2004

Efficient multi-barrier thin film encapsulation of OLED using alternating Al ₂ O ₃ and polymer layers
journal, January 2018

Experimental investigation of defect-assisted and intrinsic water vapor permeation through ultrabarrier films
journal, March 2016