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Title: High‐Performance Flexible Bismuth Telluride Thin Film from Solution Processed Colloidal Nanoplates

Authors:
 [1];  [2];  [3];  [3];  [3];  [3];  [4];  [3];  [4];  [2];  [5]; ORCiD logo [6]
  1. Department of Mechanical Engineering University of Idaho Boise ID 83702 USA
  2. Department of Chemistry and Biochemistry University of California Los Angeles CA 90095 USA
  3. Micron School of Materials Science and Engineering Boise State University Boise ID 83725 USA
  4. Micron School of Materials Science and Engineering Boise State University Boise ID 83725 USA, Center for Advanced Energy Studies Micron School of Materials Science and Engineering Boise State University Boise ID 83725 USA
  5. Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA
  6. Department of Mechanical Engineering University of Idaho Boise ID 83702 USA, Micron School of Materials Science and Engineering Boise State University Boise ID 83725 USA, Center for Advanced Energy Studies Micron School of Materials Science and Engineering Boise State University Boise ID 83725 USA
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1671364
Alternate Identifier(s):
OSTI ID: 1786234
Resource Type:
Published Article
Journal Name:
Advanced Materials Technologies
Additional Journal Information:
Journal Name: Advanced Materials Technologies Journal Volume: 5 Journal Issue: 11; Journal ID: ISSN 2365-709X
Publisher:
Wiley Blackwell (John Wiley & Sons)
Country of Publication:
United States
Language:
English

Citation Formats

Hollar, Courtney, Lin, Zhaoyang, Kongara, Madhusudan, Varghese, Tony, Karthik, Chinnathambi, Schimpf, Jesse, Eixenberger, Josh, Davis, Paul H., Wu, Yaqiao, Duan, Xiangfeng, Zhang, Yanliang, and Estrada, David. High‐Performance Flexible Bismuth Telluride Thin Film from Solution Processed Colloidal Nanoplates. United States: N. p., 2020. Web. https://doi.org/10.1002/admt.202000600.
Hollar, Courtney, Lin, Zhaoyang, Kongara, Madhusudan, Varghese, Tony, Karthik, Chinnathambi, Schimpf, Jesse, Eixenberger, Josh, Davis, Paul H., Wu, Yaqiao, Duan, Xiangfeng, Zhang, Yanliang, & Estrada, David. High‐Performance Flexible Bismuth Telluride Thin Film from Solution Processed Colloidal Nanoplates. United States. https://doi.org/10.1002/admt.202000600
Hollar, Courtney, Lin, Zhaoyang, Kongara, Madhusudan, Varghese, Tony, Karthik, Chinnathambi, Schimpf, Jesse, Eixenberger, Josh, Davis, Paul H., Wu, Yaqiao, Duan, Xiangfeng, Zhang, Yanliang, and Estrada, David. Fri . "High‐Performance Flexible Bismuth Telluride Thin Film from Solution Processed Colloidal Nanoplates". United States. https://doi.org/10.1002/admt.202000600.
@article{osti_1671364,
title = {High‐Performance Flexible Bismuth Telluride Thin Film from Solution Processed Colloidal Nanoplates},
author = {Hollar, Courtney and Lin, Zhaoyang and Kongara, Madhusudan and Varghese, Tony and Karthik, Chinnathambi and Schimpf, Jesse and Eixenberger, Josh and Davis, Paul H. and Wu, Yaqiao and Duan, Xiangfeng and Zhang, Yanliang and Estrada, David},
abstractNote = {},
doi = {10.1002/admt.202000600},
journal = {Advanced Materials Technologies},
number = 11,
volume = 5,
place = {United States},
year = {2020},
month = {10}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
https://doi.org/10.1002/admt.202000600

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