Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models

Chason, Eric; Guduru, Pradeep R.

doi:10.1063/1.4949263

Title: Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models

Abstract

Residual stress is a long-standing issue in thin film growth. Better understanding and control of film stress would lead to enhanced performance and reduced failures. In this work, we review how thin film stress is measured and interpreted. The results are used to describe a comprehensive picture that is emerging of what controls stress evolution. Examples from multiple studies are discussed to illustrate how the stress depends on key parameters (e.g., growth rate, material type, temperature, grain size, morphology, etc.). The corresponding stress-generating mechanisms that have been proposed to explain the data are also described. To develop a fuller understanding, we consider the kinetic factors that determine how much each of these processes contributes to the overall stress under different conditions. This leads to a kinetic model that can predict the dependence of the stress on multiple parameters. The model results are compared with the experiments to show how this approach can explain many features of stress evolution.

Authors:: Chason, Eric; Guduru, Pradeep R.

Publication Date:: Wed May 18 00:00:00 EDT 2016

Sponsoring Org.:: USDOE Office of Science (SC), Basic Energy Sciences (BES)

OSTI Identifier:: 1421098

Grant/Contract Number:: SC0008799

Resource Type:: Publisher's Accepted Manuscript

Journal Name:: Journal of Applied Physics

Additional Journal Information:: Journal Name: Journal of Applied Physics Journal Volume: 119 Journal Issue: 19; Journal ID: ISSN 0021-8979

Publisher:: American Institute of Physics

Country of Publication:: United States

Language:: English

Citation Formats


                    Chason, Eric, and Guduru, Pradeep R. Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models.  United States: N. p., 2016. 
Web.  doi:10.1063/1.4949263.

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                    Chason, Eric, & Guduru, Pradeep R. Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models.  United States.  https://doi.org/10.1063/1.4949263

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                    Chason, Eric, and Guduru, Pradeep R. Wed .  
"Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models".  United States.  https://doi.org/10.1063/1.4949263.

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@article{osti_1421098,

  title        = {Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models},

  author       = {Chason, Eric and Guduru, Pradeep R.},

  abstractNote = {Residual stress is a long-standing issue in thin film growth. Better understanding and control of film stress would lead to enhanced performance and reduced failures. In this work, we review how thin film stress is measured and interpreted. The results are used to describe a comprehensive picture that is emerging of what controls stress evolution. Examples from multiple studies are discussed to illustrate how the stress depends on key parameters (e.g., growth rate, material type, temperature, grain size, morphology, etc.). The corresponding stress-generating mechanisms that have been proposed to explain the data are also described. To develop a fuller understanding, we consider the kinetic factors that determine how much each of these processes contributes to the overall stress under different conditions. This leads to a kinetic model that can predict the dependence of the stress on multiple parameters. The model results are compared with the experiments to show how this approach can explain many features of stress evolution.},

  doi          = {10.1063/1.4949263},

  journal      = {Journal of Applied Physics},

  number       = 19,

  volume       = 119,

  place        = {United States},

  year         = {Wed May 18 00:00:00 EDT 2016},

  month        = {Wed May 18 00:00:00 EDT 2016}

}

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Mayrhofer, Paul H.; Mitterer, Christian; Hultman, Lars
Progress in Materials Science, Vol. 51, Issue 8
DOI: 10.1016/j.pmatsci.2006.02.002

Mechanisms of stress generation and relaxation during pulsed laser deposition of epitaxial Fe–Pd magnetic shape memory alloy films on MgO
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Edler, Tobias; Buschbeck, Jörg; Mickel, Christine
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DOI: 10.1088/1367-2630/10/6/063007

Mechanisms inducing compressive stress during electrodeposition of Ni
journal, January 2005

Hearne, Sean J.; Floro, Jerry A.
Journal of Applied Physics, Vol. 97, Issue 1
DOI: 10.1063/1.1819972

Stress evolution during growth of 1-D island arrays: Kinetics and length scaling
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Chason, E.; Engwall, A. M.; Miller, C. M.
Scripta Materialia, Vol. 97
DOI: 10.1016/j.scriptamat.2014.10.012

Effect of adatom surface diffusivity on microstructure and intrinsic stress evolutions during Ag film growth
journal, August 2012

Flötotto, D.; Wang, Z. M.; Jeurgens, L. P. H.
Journal of Applied Physics, Vol. 112, Issue 4
DOI: 10.1063/1.4746739

Stress and grain growth in thin films
journal, May 1996

Thompson, Carl V.; Carel, Roland
Journal of the Mechanics and Physics of Solids, Vol. 44, Issue 5
DOI: 10.1016/0022-5096(96)00022-1

The effect of deposition rate on the intrinsic stress in copper and silver thin films
journal, March 2007

Del Vecchio, A. L.; Spaepen, F.
Journal of Applied Physics, Vol. 101, Issue 6
DOI: 10.1063/1.2712150

Effect of ion bombardment on stress in thin metal films
journal, December 2003

Mayr, S. G.; Averback, R. S.
Physical Review B, Vol. 68, Issue 21
DOI: 10.1103/PhysRevB.68.214105

Stress behavior of electroplated Sn films during thermal cycling
journal, April 2009

Shin, Jae Wook; Chason, Eric
Journal of Materials Research, Vol. 24, Issue 4
DOI: 10.1557/jmr.2009.0172

Extensions of the Stoney formula for substrate curvature to configurations with thin substrates or large deformations
journal, April 1999

Freund, L. B.; Floro, J. A.; Chason, E.
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DOI: 10.1063/1.123722

Kinetics and magnitude of the reversible stress evolution during polycrystalline film growth interruptions
journal, August 2015

Flötotto, D.; Wang, Z. M.; Jeurgens, L. P. H.
Journal of Applied Physics, Vol. 118, Issue 5
DOI: 10.1063/1.4928162

Kinetic Model of Stress Evolution during Coalescence and Growth of Polycrystalline Thin Films
journal, May 2007

Tello, Juan S.; Bower, Allan F.; Chason, Eric
Physical Review Letters, Vol. 98, Issue 21
DOI: 10.1103/PhysRevLett.98.216104

Residual stress in Ni–W electrodeposits
journal, August 2006

Mizushima, Io; Tang, Peter T.; Hansen, Hans N.
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DOI: 10.1016/j.electacta.2005.11.053

The Past, Present, and Future of Silicon Photonics
journal, January 2006

Soref, Richard
IEEE Journal of Selected Topics in Quantum Electronics, Vol. 12, Issue 6
DOI: 10.1109/JSTQE.2006.883151

The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer–Weber thin films
journal, May 2001

Floro, J. A.; Hearne, S. J.; Hunter, J. A.
Journal of Applied Physics, Vol. 89, Issue 9
DOI: 10.1063/1.1352563

Steady-state tensile stresses during the growth of polycrystalline films
journal, September 2007

Sheldon, B.; Bhandari, A.; Bower, A.
Acta Materialia, Vol. 55, Issue 15
DOI: 10.1016/j.actamat.2007.05.008

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Thin films are critical for a wide range of advanced technologies. However, the deposited films often have high levels of residual stress that can limit their performance or lead to failure. The stress is known to depend on many variables, including the processing conditions, type of material, deposition technique and the film’s microstructure. The goal of this DOE program was to develop a fundamental understanding of how the different processes that control thin film growth under different conditions can be related to the development of stress. In the program, systematic experiments were performed or analyzed that related the stress tomore »« less
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Title: Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models

Abstract

Citation Formats

Mechanics of compressive stress evolution during thin film growth journal, November 2003

Surface stress model for intrinsic stresses in thin films journal, November 2000

Kinetic model for dependence of thin film stress on growth rate, temperature, and microstructure journal, April 2012

Real-time stress evolution during growth of In[sub x]Al[sub 1−x]As/GaAs metamorphic buffer layers journal, January 2004

An experimental study of the influence of imperfections on the buckling of compressed thin films journal, March 2002

A kinetic analysis of residual stress evolution in polycrystalline thin films journal, December 2012

Effects of strain cycling on buckling, cracking and spalling of a thermally grown alumina on a nickel-based bond coat journal, January 1999

Post-deposition reduction of internal stress in thin films: The case of HfN coatings bombarded with Au ions journal, November 1997

Relating residual stress to thin film growth processes via a kinetic model and real-time experiments journal, December 2015

Compressive Stress in Polycrystalline Volmer-Weber Films journal, April 2005

The Tension of Metallic Films Deposited by Electrolysis journal, May 1909

Full field measurements of curvature using coherent gradient sensing: application to thin film characterization journal, July 1998

Atomistic and continuum studies of crack-like diffusion wedges and associated dislocation mechanisms in thin films on substrates journal, November 2003

Electromigration in thin aluminum films on titanium nitride journal, April 1976

Measuring Ge segregation by real‐time stress monitoring during Si 1− x Ge x molecular beam epitaxy journal, December 1996

The compressive stress transition in Al, V, Zr, Nb and W metal films sputtered at low working pressures journal, September 1977

Investigation of stress and morphology in electrodeposited copper nanofilms by cantilever beam method and in situ electrochemical atomic force microscopy journal, April 2008

Bulk and interface stresses in silver‐nickel multilayered thin films journal, August 1993

Structure and internal stress in ultra-thin silver films deposited on MgF2 and SiO substrates journal, July 1978

Interfaces and stresses in thin films journal, January 2000

On the origin of compressive stress in PVD coatings — an explicative model journal, September 1991

Measurements of the intrinsic stress in thin metal films journal, January 1990

Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms journal, May 2013

Stress and microstructure evolution during growth of magnetron-sputtered low-mobility metal films: Influence of the nucleation conditions journal, December 2010

Comment on “Compressive Stress in Polycrystalline Volmer-Weber Films” journal, November 2005

Koch, Hu, and Das Reply: journal, November 2005

Mechanical stresses in (sub)monolayer epitaxial films journal, February 1990

Grain growth and complex stress evolution during Volmer–Weber growth of polycrystalline thin films journal, April 2014

Intrinsic stress in sputtered thin films journal, July 1991

Reversible Stress Relaxation during Precoalescence Interruptions of Volmer-Weber Thin Film Growth journal, September 2002

Surface and interface stress effects in thin films journal, May 1994

Microstructural evolution during film growth journal, September 2003

Atom insertion into grain boundaries and stress generation in physically vapor deposited films journal, July 2013

In situ stress evolution during magnetron sputtering of transition metal nitride thin films journal, September 2008

Stress evolution during metalorganic chemical vapor deposition of GaN journal, January 1999

Origins of Growth Stresses in Amorphous Semiconductor Thin Films journal, August 2003

Stress in Evaporated and Sputtered Thin Films – A Comparison journal, March 2010

Celebrating the 100th anniversary of the Stoney equation for film stress: Developments from polycrystalline steel strips to single crystal silicon wafers journal, January 2009

The intrinsic stress of polycrystalline and epitaxial thin metal films journal, November 1994

Elimination of stress-induced curvature in thin-film structures journal, October 2002

Real-time stress evolution during Si1-xGex Heteroepitaxy: Dislocations, islanding, and segregation journal, September 1997

Growth of patterned island arrays to identify origins of thin film stress journal, March 2014

Measurements of stress during vapor deposition of copper and silver thin films and multilayers journal, December 1996

Stress and microstructure of sputter‐deposited thin films: Molecular dynamics investigations journal, September 1987

A model for the behaviour of tensile and compressive residual stresses developed in thin films produced by ion beam-assisted deposition techniques journal, November 2004

Physical Origins of Intrinsic Stresses in Volmer–Weber Thin Films journal, January 2002

A comprehensive model of stress generation and relief processes in thin films deposited with energetic ions journal, April 2006

Stress and plastic flow in silicon during amorphization by ion bombardment journal, October 1991

Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes journal, April 2008

Intrinsic stress of polycrystalline and epitaxial Ag, Cu and Au films on mica (001) journal, May 1992

Atomistic simulations of stress and microstructure evolution during polycrystalline Ni film growth journal, June 2009

Intrinsic tensile stress and grain boundary formation during Volmer–Weber film growth journal, August 2002

Intrinsic stress in ZrN thin films: Evaluation of grain boundary contribution from in situ wafer curvature and ex situ x-ray diffraction techniques journal, May 2012

Influence of substrate temperature and deposition rate on structure of thick sputtered Cu coatings journal, July 1975

An intrinsic stress scaling law for polycrystalline thin films prepared by ion beam sputtering journal, September 1987

Tensile stress generation during island coalescence for variable island-substrate contact angle journal, June 2003

Internal stress and structure of ultrahigh vacuum evaporated chromium and iron films and their dependence on substrate temperature and oxygen partial pressure during deposition journal, November 1990

Understanding Residual Stress in Electrodeposited Cu Thin Films journal, January 2013

Piezoresistive microcantilevers for in situ stress measurements during thin film deposition journal, July 2005

Stresses in thin films: The relevance of grain boundaries and impurities journal, May 1976

Generation and evolution of residual stresses in physical vapour-deposited thin films journal, May 2001

Stress-related effects in thin films journal, April 1989

Model for stress generated upon contact of neighboring islands on the surface of a substrate journal, May 2001

Role of atomic migration in nanocrystalline stability: Grain size and thin film stress states journal, April 2015

Crystallite coalescence: A mechanism for intrinsic tensile stresses in thin films journal, August 1999

A UHV‐compatible thin‐film stress‐measuring apparatus based on the cantilever beam principle journal, December 1990

In situ sensitive measurement of stress in thin films journal, May 1992

Stress evolution in Si during low-energy ion bombardment journal, November 2014

Compressive Stress Generation in Sn Thin Films and the Role of Grain Boundary Diffusion journal, July 2009

Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history journal, March 1987

Measuring the interface stress: Silver/nickel interfaces journal, November 1999

Mechanisms of stress generation during bombardment of Ge with keV ions: experiments and molecular dynamics simulations journal, September 2007

Hyperthermal vapor deposition of copper: athermal and biased diffusion effects journal, July 1999

Real-time stress measurements in lithium-ion battery negative-electrodes journal, May 2012

Stresses and deformation processes in thin films on substrates journal, January 1988

Aluminum films deposited by rf sputtering journal, March 1970

Origin of Compressive Residual Stress in Polycrystalline Thin Films journal, March 2002

Mechanics of compressive stress evolution during thin film growth
journal, November 2003

Surface stress model for intrinsic stresses in thin films
journal, November 2000

Kinetic model for dependence of thin film stress on growth rate, temperature, and microstructure
journal, April 2012

Real-time stress evolution during growth of In[sub x]Al[sub 1−x]As/GaAs metamorphic buffer layers
journal, January 2004

An experimental study of the influence of imperfections on the buckling of compressed thin films
journal, March 2002

A kinetic analysis of residual stress evolution in polycrystalline thin films
journal, December 2012

Effects of strain cycling on buckling, cracking and spalling of a thermally grown alumina on a nickel-based bond coat
journal, January 1999

Post-deposition reduction of internal stress in thin films: The case of HfN coatings bombarded with Au ions
journal, November 1997

Relating residual stress to thin film growth processes via a kinetic model and real-time experiments
journal, December 2015

Compressive Stress in Polycrystalline Volmer-Weber Films
journal, April 2005

The Tension of Metallic Films Deposited by Electrolysis
journal, May 1909

Full field measurements of curvature using coherent gradient sensing: application to thin film characterization
journal, July 1998

Atomistic and continuum studies of crack-like diffusion wedges and associated dislocation mechanisms in thin films on substrates
journal, November 2003

Electromigration in thin aluminum films on titanium nitride
journal, April 1976

Measuring Ge segregation by real‐time stress monitoring during Si _{1− x} Ge _x molecular beam epitaxy
journal, December 1996

The compressive stress transition in Al, V, Zr, Nb and W metal films sputtered at low working pressures
journal, September 1977

Investigation of stress and morphology in electrodeposited copper nanofilms by cantilever beam method and in situ electrochemical atomic force microscopy
journal, April 2008

Bulk and interface stresses in silver‐nickel multilayered thin films
journal, August 1993

Structure and internal stress in ultra-thin silver films deposited on MgF2 and SiO substrates
journal, July 1978

Interfaces and stresses in thin films
journal, January 2000

On the origin of compressive stress in PVD coatings — an explicative model
journal, September 1991

Measurements of the intrinsic stress in thin metal films
journal, January 1990

Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms
journal, May 2013

Stress and microstructure evolution during growth of magnetron-sputtered low-mobility metal films: Influence of the nucleation conditions
journal, December 2010

Comment on “Compressive Stress in Polycrystalline Volmer-Weber Films”
journal, November 2005

Koch, Hu, and Das Reply:
journal, November 2005

Mechanical stresses in (sub)monolayer epitaxial films
journal, February 1990

Grain growth and complex stress evolution during Volmer–Weber growth of polycrystalline thin films
journal, April 2014

Intrinsic stress in sputtered thin films
journal, July 1991

Reversible Stress Relaxation during Precoalescence Interruptions of Volmer-Weber Thin Film Growth
journal, September 2002

Surface and interface stress effects in thin films
journal, May 1994

Microstructural evolution during film growth
journal, September 2003

Atom insertion into grain boundaries and stress generation in physically vapor deposited films
journal, July 2013

In situ stress evolution during magnetron sputtering of transition metal nitride thin films
journal, September 2008

Stress evolution during metalorganic chemical vapor deposition of GaN
journal, January 1999

Origins of Growth Stresses in Amorphous Semiconductor Thin Films
journal, August 2003

Stress in Evaporated and Sputtered Thin Films – A Comparison
journal, March 2010

Celebrating the 100th anniversary of the Stoney equation for film stress: Developments from polycrystalline steel strips to single crystal silicon wafers
journal, January 2009

The intrinsic stress of polycrystalline and epitaxial thin metal films
journal, November 1994

Elimination of stress-induced curvature in thin-film structures
journal, October 2002

Real-time stress evolution during Si1-xGex Heteroepitaxy: Dislocations, islanding, and segregation
journal, September 1997

Growth of patterned island arrays to identify origins of thin film stress
journal, March 2014

Measurements of stress during vapor deposition of copper and silver thin films and multilayers
journal, December 1996

Stress and microstructure of sputter‐deposited thin films: Molecular dynamics investigations
journal, September 1987

A model for the behaviour of tensile and compressive residual stresses developed in thin films produced by ion beam-assisted deposition techniques
journal, November 2004

Physical Origins of Intrinsic Stresses in Volmer–Weber Thin Films
journal, January 2002

A comprehensive model of stress generation and relief processes in thin films deposited with energetic ions
journal, April 2006

Stress and plastic flow in silicon during amorphization by ion bombardment
journal, October 1991

Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes
journal, April 2008

Intrinsic stress of polycrystalline and epitaxial Ag, Cu and Au films on mica (001)
journal, May 1992

Atomistic simulations of stress and microstructure evolution during polycrystalline Ni film growth
journal, June 2009

Intrinsic tensile stress and grain boundary formation during Volmer–Weber film growth
journal, August 2002

Intrinsic stress in ZrN thin films: Evaluation of grain boundary contribution from in situ wafer curvature and ex situ x-ray diffraction techniques
journal, May 2012

Influence of substrate temperature and deposition rate on structure of thick sputtered Cu coatings
journal, July 1975

An intrinsic stress scaling law for polycrystalline thin films prepared by ion beam sputtering
journal, September 1987

Tensile stress generation during island coalescence for variable island-substrate contact angle
journal, June 2003

Internal stress and structure of ultrahigh vacuum evaporated chromium and iron films and their dependence on substrate temperature and oxygen partial pressure during deposition
journal, November 1990

Understanding Residual Stress in Electrodeposited Cu Thin Films
journal, January 2013

Piezoresistive microcantilevers for in situ stress measurements during thin film deposition
journal, July 2005

Stresses in thin films: The relevance of grain boundaries and impurities
journal, May 1976

Generation and evolution of residual stresses in physical vapour-deposited thin films
journal, May 2001

Stress-related effects in thin films
journal, April 1989

Model for stress generated upon contact of neighboring islands on the surface of a substrate
journal, May 2001

Role of atomic migration in nanocrystalline stability: Grain size and thin film stress states
journal, April 2015

Crystallite coalescence: A mechanism for intrinsic tensile stresses in thin films
journal, August 1999

A UHV‐compatible thin‐film stress‐measuring apparatus based on the cantilever beam principle
journal, December 1990

In situ sensitive measurement of stress in thin films
journal, May 1992

Stress evolution in Si during low-energy ion bombardment
journal, November 2014

Compressive Stress Generation in Sn Thin Films and the Role of Grain Boundary Diffusion
journal, July 2009

Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history
journal, March 1987

Measuring the interface stress: Silver/nickel interfaces
journal, November 1999

Mechanisms of stress generation during bombardment of Ge with keV ions: experiments and molecular dynamics simulations
journal, September 2007

Hyperthermal vapor deposition of copper: athermal and biased diffusion effects
journal, July 1999

Real-time stress measurements in lithium-ion battery negative-electrodes
journal, May 2012

Stresses and deformation processes in thin films on substrates
journal, January 1988

Aluminum films deposited by rf sputtering
journal, March 1970

Origin of Compressive Residual Stress in Polycrystalline Thin Films
journal, March 2002

Stress in hard metal films
journal, October 2004

Direct Evidence for Effects of Grain Structure on Reversible Compressive Deposition Stresses in Polycrystalline Gold Films
journal, June 2009

Electron microscope structure and internal stress in thin silver and gold films deposited onto MgF2 and SiO substrates
journal, April 1979