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Title: Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models

Authors:
 [1] ;  [1]
  1. School of Engineering, Brown University, Providence, Rhode Island 02912-9104, USA
Publication Date:
Grant/Contract Number:
SC0008799
Type:
Publisher's Accepted Manuscript
Journal Name:
Journal of Applied Physics
Additional Journal Information:
Journal Name: Journal of Applied Physics Journal Volume: 119 Journal Issue: 19; Journal ID: ISSN 0021-8979
Publisher:
American Institute of Physics
Sponsoring Org:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
Country of Publication:
United States
Language:
English
OSTI Identifier:
1421098

Chason, Eric, and Guduru, Pradeep R. Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models. United States: N. p., Web. doi:10.1063/1.4949263.
Chason, Eric, & Guduru, Pradeep R. Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models. United States. doi:10.1063/1.4949263.
Chason, Eric, and Guduru, Pradeep R. 2016. "Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models". United States. doi:10.1063/1.4949263.
@article{osti_1421098,
title = {Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models},
author = {Chason, Eric and Guduru, Pradeep R.},
abstractNote = {},
doi = {10.1063/1.4949263},
journal = {Journal of Applied Physics},
number = 19,
volume = 119,
place = {United States},
year = {2016},
month = {5}
}

Works referenced in this record:

Electromigration in thin aluminum films on titanium nitride
journal, April 1976
  • Blech, I. A.
  • Journal of Applied Physics, Vol. 47, Issue 4, p. 1203-1208
  • DOI: 10.1063/1.322842

Surface and interface stress effects in thin films
journal, May 1994

Origin of Compressive Residual Stress in Polycrystalline Thin Films
journal, March 2002