DOE PAGES title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Review Article: Reactions of fluorine atoms with silicon, revisited, again

Journal Article · · Journal of Vacuum Science and Technology A
DOI: https://doi.org/10.1116/1.4983922 · OSTI ID:1361942
 [1]
  1. Department of Chemical and Biomolecular Engineering, University of Houston, Engineering Bldg. D, 4800 Calhoun Rd., Houston, Texas 77204

Not Available

Sponsoring Organization:
USDOE
OSTI ID:
1361942
Journal Information:
Journal of Vacuum Science and Technology A, Journal Name: Journal of Vacuum Science and Technology A Journal Issue: 5 Vol. 35; ISSN 0734-2101; ISSN JVTAD6
Publisher:
American Vacuum SocietyCopyright Statement
Country of Publication:
United States
Language:
English

References (47)

Gas phase reactions of SiF2 with F2 and Cl2 journal December 1985
Control of relative etch rates of SiO2 and Si in plasma etching journal December 1975
A theoretical study of the electronic spectroscopy of the SiF3 radical journal July 2001
Chemiluminescence and the reaction of molecular fluorine with silicon journal November 1981
Reactivity of Fluorinated Si(100) with F2 journal December 2000
Chemiluminescent titration of F(g) with Cl2(g) and microwave production of atomic fluorine
  • Nordine, Paul C.; Rosner, Daniel E.
  • Journal of the Chemical Society, Faraday Transactions 1: Physical Chemistry in Condensed Phases, Vol. 72, Issue 0 https://doi.org/10.1039/f19767201526
journal January 1976
Kinetics and mechanism of the gas-phase pyrolysis of hexafluorodisilane in the presence of iodine and some reactions of silicon difluoride journal January 1986
Thermochemical Properties of Si2F6 and SiF4 in Gas and Condensed Phases journal January 2001
Absolute fluorine atom concentrations in fluorocarbon plasmas determined from CF2 loss kinetics journal June 2001
Atomistic simulations of spontaneous etching of silicon by fluorine and chlorine journal July 2004
Mass and Auger electron spectroscopy studies of the interactions of atomic and molecular chlorine on a plasma reactor wall journal January 2008
The role of chemisorption in plasma etching journal October 1978
Plasma etching of Si and SiO 2 —The effect of oxygen additions to CF 4 plasmas journal July 1978
Ion‐ and electron‐assisted gas‐surface chemistry—An important effect in plasma etching journal May 1979
In situ Auger electron spectroscopy of Si and SiO2 surfaces plasma etched in CF4-H2 glow discharges journal January 1979
Studies of chemiluminescence accompanying fluorine atom etching of silicon journal January 1980
The reaction of fluorine atoms with silicon journal May 1981
Reaction of atomic fluorine with silicon: The gas phase products journal May 1982
Chemiluminescent reaction of SiF2 with fluorine and the etching of silicon by atomic and molecular fluorine journal June 1982
Silicon etching mechanism and anisotropy in CF4+O2plasma journal October 1983
The reaction probability of XeF2with silicon journal November 1983
Gaseous products from the reaction of XeF2with silicon journal March 1983
Anisotropic etching of SiO2in low‐frequency CF4/O2and NF3/Ar plasmas journal January 1984
Reaction of atomic fluorine with silicon journal August 1985
Laser‐induced fluorescence study of silicon etching process: Detection of SiF2and CF2radicals journal December 1986
Role of sulfur atoms in microwave plasma etching of silicon journal August 1987
SiF2as a primary desorption product of Si etching by F atoms: Interpretation of laser‐induced fluorescence spectra; rate constant of the gas phase SiF2+F reaction journal October 1991
Electron impact ionization cross sections of SiF2 journal October 1988
Recombination of chlorine atoms on plasma-conditioned stainless steel surfaces in the presence of adsorbed Cl2 journal February 2009
Absolute fluorine atom concentrations in RIE and ECR CF4plasmas measured by actinometry journal May 1994
Laser-induced fluorescence detection of as a primary product of Si and reactive ion etching with gas journal August 1997
Absolute radical densities in etching plasmas determined by broad-band UV absorption spectroscopy journal August 1998
Chemical sputtering of fluorinated silicon journal January 1981
Infrared Absorption Spectrum of Sulfur-Doped Silicon journal June 1962
Determination of electron temperature, atomic fluorine concentration, and gas temperature in inductively coupled fluorocarbon/rare gas plasmas using optical emission spectroscopy
  • Schabel, M. J.; Donnelly, V. M.; Kornblit, A.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 20, Issue 2 https://doi.org/10.1116/1.1454126
journal March 2002
Etching silicon by SF6 in a continuous and pulsed power helicon reactor
  • Herrick, A.; Perry, A. J.; Boswell, R. W.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 21, Issue 4 https://doi.org/10.1116/1.1575215
journal July 2003
Feature-scale model of Si etching in SF6 plasma and comparison with experiments
  • Belen, Rodolfo Jun; Gomez, Sergi; Kiehlbauch, Mark
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 23, Issue 1 https://doi.org/10.1116/1.1830495
journal January 2005
Penetration of fluorine into the silicon lattice during exposure to F atoms, F2, and XeF2: Implications for spontaneous etching reactions
  • Winters, Harold F.; Graves, D. B.; Humbird, D.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 25, Issue 1 https://doi.org/10.1116/1.2400680
journal January 2007
Plasma etching: Yesterday, today, and tomorrow journal September 2013
Plasma etching—A discussion of mechanisms journal March 1979
Etching rate characterization of SiO 2 and Si using ion energy flux and atomic fluorine density in a CF 4 /O 2 /Ar electron cyclotron resonance plasma
  • Ding, J.; Jenq, J. ‐S.; Kim, G. ‐H.
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 11, Issue 4 https://doi.org/10.1116/1.578540
journal July 1993
Chlorine‐enhanced F‐atom etching of silicon journal May 1994
Etching reactions for silicon with F atoms: Product distributions and ion enhancement mechanisms journal March 1991
Comparison of the Fluorine Atom Density Measured by Actinometry and Vacuum Ultraviolet Absorption Spectroscopy journal September 1997
Comparison of  F 2‐Based Gases for High‐Rate Dry Etching of Si journal October 1999
The Loading Effect in Plasma Etching journal August 1977
RF Sputter-Etching by Fluoro-Chloro-Hydrocarbon Gases journal January 1974

Similar Records

Reaction of atomic fluorine with silicon: The gas phase products
Journal Article · 1982 · J. Appl. Phys.; (United States) · OSTI ID:5584430

Studies of atomic and molecular fluorine reactions on silicon surfaces
Journal Article · 1986 · Appl. Phys. Lett.; (United States) · OSTI ID:6102058

Invited Review Article: Atom probe tomography
Journal Article · 2007 · Review of Scientific Instruments · OSTI ID:20953383

Related Subjects