Thermionic converter emitter support arrangement
Abstract
A support is provided for use in a thermionic converter to support an end an emitter to keep it out of contact with a surrounding collector while allowing the emitter end to move axially at its temperatures changes. The emitter end (34) is supported by a spring structure (44) that includes a pair of Belleville springs, and the spring structure is supported by a support structure (42) fixed to the housing that includes the collector. The support structure is in the form of a sandwich with a small metal spring-engaging element (74) at the front end, a larger metal main support (76) at the rear end that is attached to the housng, and with a ceramic layer (80) between them that is bonded by hot isostatic pressing to the metal element and metal main support. The spring structure can include a loose wafer (120) captured between the Belleville springs.
- Inventors:
-
- La Jolla, CA
- Issue Date:
- Research Org.:
- GA TECHNOLOGIES INC
- OSTI Identifier:
- 867561
- Patent Number(s):
- 4963319
- Assignee:
- United States of America as represented by Department of Energy (Washington, DC)
- Patent Classifications (CPCs):
-
G - PHYSICS G21 - NUCLEAR PHYSICS G21D - NUCLEAR POWER PLANT
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02E - REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- DOE Contract Number:
- AC03-86SF16298
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- thermionic; converter; emitter; support; arrangement; provided; contact; surrounding; collector; allowing; move; axially; temperatures; changes; 34; supported; spring; structure; 44; pair; belleville; springs; 42; fixed; housing; form; sandwich; metal; spring-engaging; element; 74; front; larger; main; 76; rear; attached; housng; ceramic; layer; 80; bonded; hot; isostatic; pressing; loose; wafer; 120; captured; metal main; thermionic converter; metal element; support structure; hot isostatic; isostatic pressing; support arrangement; main support; belleville springs; spring structure; ceramic layer; surrounding collector; spring-engaging element; loose wafer; metal spring-engaging; move axially; larger metal; emitter support; converter emitter; metal spring; /376/976/
Citation Formats
Allen, Daniel T. Thermionic converter emitter support arrangement. United States: N. p., 1990.
Web.
Allen, Daniel T. Thermionic converter emitter support arrangement. United States.
Allen, Daniel T. Mon .
"Thermionic converter emitter support arrangement". United States. https://www.osti.gov/servlets/purl/867561.
@article{osti_867561,
title = {Thermionic converter emitter support arrangement},
author = {Allen, Daniel T},
abstractNote = {A support is provided for use in a thermionic converter to support an end an emitter to keep it out of contact with a surrounding collector while allowing the emitter end to move axially at its temperatures changes. The emitter end (34) is supported by a spring structure (44) that includes a pair of Belleville springs, and the spring structure is supported by a support structure (42) fixed to the housing that includes the collector. The support structure is in the form of a sandwich with a small metal spring-engaging element (74) at the front end, a larger metal main support (76) at the rear end that is attached to the housng, and with a ceramic layer (80) between them that is bonded by hot isostatic pressing to the metal element and metal main support. The spring structure can include a loose wafer (120) captured between the Belleville springs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Jan 01 00:00:00 EST 1990},
month = {Mon Jan 01 00:00:00 EST 1990}
}