Technique for constructing high gradient insulators
Abstract
A process for constructing a high-tensile strength, high-gradient insulator (HGI) may include stacking alternating layers of conductors and insulators, and vacuum pressure potting the stacked layers onto an insulating rod. The process may also include post machining the stacked layers to form a complete assembly of the HGI.
- Inventors:
- Issue Date:
- Research Org.:
- Triad National Security, LLC, Los Alamos, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1860186
- Patent Number(s):
- 11205530
- Application Number:
- 16/217,021
- Assignee:
- Triad National Security, LLC (Los Alamos, NM)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01B - CABLES
- DOE Contract Number:
- 89233218CNA000001
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 12/11/2018
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Watson, Scott Avery, Winch, Nicola Maree, Sorensen, Eric Byron, Bronisz, Lawrence Eugene, Platts, David, Krogh, Michael L., Noroña, Marcelo, and Duran, Phillip A. Technique for constructing high gradient insulators. United States: N. p., 2021.
Web.
Watson, Scott Avery, Winch, Nicola Maree, Sorensen, Eric Byron, Bronisz, Lawrence Eugene, Platts, David, Krogh, Michael L., Noroña, Marcelo, & Duran, Phillip A. Technique for constructing high gradient insulators. United States.
Watson, Scott Avery, Winch, Nicola Maree, Sorensen, Eric Byron, Bronisz, Lawrence Eugene, Platts, David, Krogh, Michael L., Noroña, Marcelo, and Duran, Phillip A. Tue .
"Technique for constructing high gradient insulators". United States. https://www.osti.gov/servlets/purl/1860186.
@article{osti_1860186,
title = {Technique for constructing high gradient insulators},
author = {Watson, Scott Avery and Winch, Nicola Maree and Sorensen, Eric Byron and Bronisz, Lawrence Eugene and Platts, David and Krogh, Michael L. and Noroña, Marcelo and Duran, Phillip A.},
abstractNote = {A process for constructing a high-tensile strength, high-gradient insulator (HGI) may include stacking alternating layers of conductors and insulators, and vacuum pressure potting the stacked layers onto an insulating rod. The process may also include post machining the stacked layers to form a complete assembly of the HGI.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Dec 21 00:00:00 EST 2021},
month = {Tue Dec 21 00:00:00 EST 2021}
}
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Works referenced in this record:
Chip carrier package and method of manufacture
patent, October 1990
- Lott, John W.; Poulin, Thomas Raymond; Wallace, Patrick W.
- US Patent Document 4,965,702
Multilayer circuit board
patent-application, August 2002
- Ishiwa, Masayuki; Iizuka, Kenji; Nishimura, Takeshi
- US Patent Application 09/779691; 20020104681
Apparatus for laminating multilayered printed circuit boards
patent, June 1986
- Frohlich, Sigurd; Morris, James
- US Patent Document 4,596,624
Formation method of metal layer on resin layer, printed wiring board, and production method thereof
patent, November 2009
- Takai, Kenji; Moriike, Norio; Kamiyama, Kenichi
- US Patent Document 7,615,277
Multilayer circuit board fabricated from silicon
patent, February 1989
- Burgess, James F.; Glascock, II, Homer H.; Webster, Harold F.
- US Patent Document 4,803,450
Method for manufacturing multilayer circuit board and resin base material
patent, November 2009
- Wakizaka, Yasuhiro; Ikeda, Koichi; Kanda, Naoki
- US Patent Document 7,614,145